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MATERIAL ADVANCEMENTS


The new polymer is modified to allow compatibility with conventional tetramethyl ammonium hydroxide (TMAH)- based developers, vs. the traditional solvent-based BCB photodielectric. The new aqueous-developable BCB photodielectric material can easily produce patterned features to 5µm and below, with aspect ratios of 2:1 (Figure 4).


In addition to lower COO and the aforementioned lower residual stress, this photodielectric material also exhibits desirable properties such as low-temperature cure, high thermal stability with low outgassing to withstand SnAg reflow temperatures and excellent mechanical properties needed to survive integration and meet the needs for improved elongation.


Conclusion


Materials suppliers increasingly find themselves in the role of developing solutions to overcome known challenges or limitations of existing processes and equipment. The surest and most efficient approach to address the emerging requirements of next-generation devices is to innovate new technologies that leverage and optimize proven materials when possible. Therefore, combining the known performance of existing


Figure 4: 70ᴼ tilt cross sections SEM of XP120201 depicting 5 µm, 1:2 contact holes after develop (left) and after soft cure (right).


material sets with the enhanced capabilities of new chemistries is ideal for accelerating the transition to future manufacturing nodes.


As a result, a full suite of compatible chemistries is now ready to meet the needs of next-generation wafer-level, 2.5D and 3D packaging technologies.


© 2013 Angel Business Communications. Permission required.


References 1. D. Patterson, “2.5/3D Packaging Enablement through Copper Pillar Technology”, Chip Scale Review, July/Aug 2012, p20 2. J. A. Sharpe, M. B. Jordan, S. L. Burkett, and M. E. Barkey, “Analyzing the Behavior and Shear Strength of Common Adhesives used in Temporary Wafer Bonding” Proc., 2013 Electronic Components Technologies Conference, pp 94-95 3. K. Karaminal, “A Comparative Simulation Study of 3D Through Silicon Stack Assembly Processes”, Proc. 2013 Electronics Components Technology Conference p. 1


Gold Pellets


Deposition Materials


LICO


SPUTTERING TARGETS - Thin Film Battery - Mixed Metal Oxides


EVAPORATION - Fabmate® Crucibles - Gold Pellets


SERVICES


- Precious Metal Reclaim - Target Bonding


LIPO Fabmate®


www.lesker.com Enabling Technology for a Better World


13-174 Issue IV 2013 www.siliconsemiconductor.net 33


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