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PRECISION BONDERS


kind of accuracy combined with a very large substrate working area for a panel size of up to 600 x 600 mm.


NovaPlus accuracy test in a live environment An accuracy test at a real working NOVAPlus machine is given in Figure 7, taken after the bond measurements. The cyancoloured frame shows the +/- 2.5µm target area. All parts with less epoxy material are inside this processing window. Those with more epoxy show a much larger distribution and offset in the Y direction: About 10 percent of them are outside the +/- 2.5µm window.


Both the AFCPlus and the NOVAPlus were exhibited at the recent Semicon Taiwan and at Semicon West in San Francisco, Next stop on the high-accuracy Amicra die bonding solutions will be Productronica 2013 in Munich, Germany and Amicra looks unstoppable.


Figure 4: NOVAPlus opened


The machine also features active bond force control, at a bond force of up to 5 kilograms. These specs make the NOVAPlus well suited for eutectic, epoxy, and laser bonding. Alignment is passive. Post-bond inspection and measurement is also a standard feature.


Accommodating very large panel sizes The NOVAPlus modular concept aims at micro-assembly applications in various segments of advanced semiconductor packaging, including TSV and eWLB, 3D-IC, complex die stacking, WLP and AuSn processing.


This is especially valuable for the placement of large fan-out panels of up to 370 x 470 mm, at an accuracy of +/- 2.5µm as realized for one of the largest Taiwanese Assemblers (Figure 6).


According to Dr. Weinhändler, the NOVAPlus currently is the only machine on the market for such a process that offers this


Figure 6: NOVAPlus configured for very large substrates up to 600 x 600mm


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Figure 5: The dual bond head concept 28 www.siliconsemiconductor.net Issue IV 2013


Figure 7. NOVAPlus accuracy test after bond measurements


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