This page contains a Flash digital edition of a book.
4th


CS International Conference Keynote Speakers Announced!


7 themes and 30 inspiring presentations*


Gain a comprehensive overview of the entire compound semiconductor industry at the leading international conference.


The 4th CS International conference will be held at the


Sheraton Frankfurt Airport Hotel, Germany over two days on Tuesday 18th


& Wednesday 19th March 2014.


Delegates will have the unique opportunity to network with the world’s top executives in compound semiconductor technology. Hear about the breakthroughs in device technology; insights into the current status and


the evolution of compound semiconductor devices; and details of advances in tools and processes which could help boost fab yields and throughputs.


This event is held once a year and brings together the best in class of the compound semiconductor industry, book your place before the 30th November 2013 and take advantage of our early bird discounted rate.


Chaired by: Dr Andrew Nelson, IQE 1. Front Ends for Mobile Devices


Handset front-ends are becoming more complex, due to an ever-increasing number of bands used for mobile communication. Will this trend play into the hands of GaAs chipmakers? Or is silicon CMOS technology going to grab market share?


Keynote presentation: Jeremy Hendy Envelope Tracking - transforming the performance of CMOS and GaAs PAs


2. Wide Bandgap RF Devices


GaN and SiC have a great set of attributes that make them very promising materials for producing RF devices. But are they now fulfilling their potential and netting substantial sales?


Keynote Presentation: Andrew Barnes Overview of GaN reliability improvement activities at the European Space Agency


3. LEDs


LEDs are the dominant source for backlighting screens of all size. So, to penetrate new markets and grow revenues, can chipmakers now trim the cost-per-lumen of the LED or equip the device with additional features?


Keynote Presentation: Young Soo Park Slashing LED costs with 200 mm Silicon substrates


* All speakers and presentations are subject to change.


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48