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Die and Flip Chip Bonding for Ultra High Precision


IWLPC, November 5-7, 2013, San Jose, CA Productronica, November, 12-15, 2013, Munich


AFCPLUS


· Die Attach & Flip Chip System · Fully automatic System · ± 0,5 µm Placement accuracy · Cycle time < 15 seconds · Working area up to 300 x 300 mm


NOVAPLUS


· Die Attach & Flip Chip System · Fully automatic System · ± 2,5 µm Placement accuracy · Cycle time < 3 seconds · Working area up to 600 x 600 mm


AMICRA MICROTECHNOLOGIES GMBH WERNERWERKSTR. 4 D-93049 REGENSBURG, GERMANY


TEL: +49- 941-208209 0 E-MAIL: SALES@AMICRA.COM WWW.AMICRA.COM


MORE THAN PRECISION MORE THAN PRECISION


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