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Modutek partners with WRS on 450mm silicon reclaiming

MODUTEK CORPORATION is working with WRS Materials which provides silicon wafer polishing services, on a 450mm wafer cleaning development project. Richard Mee, President of WRS Materials, says, “Modutek Corporation’s expertise on tank design and wet clean technology was crucial to our 450mm upgrade”.

The new cleaning line will feature Modutek custom designed chemical baths that will incorporate Kiajo megasonics and custom wafer furniture capable of handling five 450mm wafers per fixture. Doug Wagner, President/CEO of Modutek Corporation, comments, “We were able to offer WRS new processing methods that will help them provide critical cost effective solutions

to their customers. It will work to reduce the overall cost of the initial 450mm investments.”

He goes on to say, “Our collaboration with WRS provided us the opportunity to utilise our custom designed semiconductor wet processing equipment and ensures they meet all SEMI standard requirements.”

This new reclaim line is among the first in operation globally and will reclaim 450mm wafers for most of the blue chip OEM’s. With a growing demand and the high cost of 450mm silicon wafers, reclaiming wafers will be a vital resource to the industry for many years to come. Worldwide, the 2011 reclaim wafer market was estimated at $374 million

and is expected to reach as high as $413 million in 2013. “Technology advancements are driving higher quality standards, these new specifications demand constant investment in better tool sets, strong engineering support and improved training for our production staff. Fortunately we have found a willing partner in Modutek to help in all three areas”, comments Richard Mee.

Wagner adds, “Modutek’s Megasonic Cleaning Equipment offers a precision cleaning system that was developed for the unique requirements of the Semiconductor, FPD, Hard Disk, Solar and Crystal industries. Our engineers work closely with our customers to provide a solution for each specific application.”

Rudolph expands macro defect inspection series

RUDOLPH TECHNOLOGIES has launched its new NSX 220 automated macro defect inspection system. The company says its system, pictured above, provides fast, easy defect inspection for traditional back-end processes in the semiconductor, MEMS and LED market at a reduced price.

The NSX 220 tool joins the NSX 320 system in the NSX family of automated macro defect inspection and metrology systems for final manufacturing facilities. The first NSX 220 system was installed in July at a major outsourced assembly and test (OSAT) facility in Asia.

Mike Jost, vice president and general manager of Rudolph’s Inspection Business Unit says, “The NSX 220 system is a streamlined version of our NSX 320 system.

The NSX 220 system is designed for traditional macro defect inspection of wafers up to 300mm at conventional semiconductor, MEMS and LED final manufacturing facilities, while the NSX 320 System serves next-generation advanced packaging processes with defect inspection and three-dimensional metrology for wafers up to 450mm.” He continues, “The NSX 220 system

benefits from many of the hardware and software innovations that made the NSX 320 system the market leader in advanced packaging, but is targeted for back-end facilities that do not need the full suite of capabilities offered by the NSX 320 System. Adding the NSX 220 system to the NSX family gives our customers a choice of best-in-class capabilities.”

The NSX 220 is an automated macro defect inspection system that uses grey-scale image analysis (with colour image capture) to provide fast, accurate inspection and metrology in final manufacturing applications for wafers up to 300mm. It can detect traditional advanced macro defects such as scratches, mechanical damage, foreign materials, voids and probe damage, while also performing two-dimensional measurements on bumps, probe marks and edge trim processes.

The tool operates over a range of resolutions (10µm - 0.5µm) with both brightfield and optional darkfield illumination. The software platform, leveraged from the NSX 320 system’s success, uses host-based image processing and delivers significant improvements in usability and

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productivity over older-generation NSX series equipment. Using centrally- managed recipe creation and editing, multiple NSX 220 tools can share a single recipe and be matched across the fab.

An optional suite of yield management software optimises the productivity of both the NSX 220 and 320 systems and minimises the need for operator assistance. Discover Software is designed for use with Rudolph inspection systems to allow real-time analysis for faster solutions and intelligent defect sampling for reduced offline review.

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