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www.us-tech.com
September, 2013
Indium: New Technology Solder Improves Drop-Shock
Utica, NY — Indium Corporation has introduced a new technology platform using the SACM™ solder alloy that satisfies the continuing demand for cost-effective reliability requirements of portable electronic devices. The new solder alloy reportedly offers drop shock performance far superior to other SAC alloys, without compro- mising on thermal cycling. Its low sil- ver content makes this a cost-effective solution for portable electronics.
The platform consists of In -
dium8.9 Series solder pastes using the company’s patent-pending SACM solder alloy technology for board-side interconnect, and SACM solder balls for package level interconnect. The portable electronics indus-
try is faced with the ongoing chal- lenges to: improve drop-shock per- formance without sacrificing ther- mal cycling performance; reduce the need for expensive board-level
See at IMAPS Booth #409.
underfills (and the associated mate- rial, process and re-work costs), as well as the inability to even reach some areas with underfill; and reduce costs by extending wafer- level package size to larger areas, enabling higher functionality of the low cost-per-I/O package. Solder joint architectures that
utilize both SACM solder paste and SACM solder balls can maximize reliability benefits with enhanced
New solder technology solves failed joint problems.
interfaces for both solder-to-package
and solder-to-printed circuit board. Contact: Indium Corporation,
34 Robinson Road, Clinton, NY 13323 % 315-381-7524 Web:
www.indium.com
Passive Plus: Broadband RF Capacitor
Huntington, NY — Passive Plus has introduced its broadband capacitor — the PPI 0402BB104 — intended pri- marily for coupling RF signals or bypassing them to ground over extra - ordinarily large RF bandwidths. The new chip is a 100nF capacitor and offers resonance-free, low-loss opera- tion from 16kHz (–3dB point) to >35GHz at 25V with an insertion loss of <1.2dB.
Applications for which these
parts are intended are those that require small, surface-mountable (SMT) devices with low insertion losses and reflections across RF fre- quencies extending from the tens of kHz to the tens of GHz, and temper- atures typically ranging from –55 to +125°C. Applications are primarily found
in the “signal integrity” market that includes: optoelectronics/ high-speed data; ROSA/TOSA (transmit/receive optical subassemblies); SONET (snchronous optical networks); broad- band test equipment; and broadband microwave and millimeter wave am - pli fiers and oscillators. The BB series capaciors are
especially suitable for customers requiring surface-mountable, 10nF or 100nF X7R capacitors that provide resonance-free, low insertion loss, and low reflection operation over
extremely large RF bandwidths. Contact: Passive Plus, Inc.,
45 Whitson Rd., Huntington Station, NY 11746 % 631-425-0938 fax: 631-425-0847 E-mail:
sales@passiveplus.com Web:
www.passiveplus.com
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