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www.us-tech.com
September, 2013
Schlumpf Expands Internally With Vertical Lift Storage
By Christina Dube, Marketing Communications Manager, Kardex Remstar
challenge; a single roll of packaging can weigh up to several hundred pounds. Schlumpf USA is a recog- nized leader in a the packaging in- dustry for roll and shaft handling products, as well as machinery com- ponents for unwinding and rewind- ing packing materials and aerospace composites. Hoist-based and portable ergonomic handling systems from Schlumpf lift, load, and turn the packaging rolls, minimizing the er- gonomic stress on the operator as well as reducing the risk of damage to the roll. With business steadily growing,
A
Schlumpf’s 5,280ft2 manufacturing facility in Windham, ME was burst- ing at the seams. Parts were stored on standard pallet rack that was ac- cessed with a stacker truck. Workers would navigate the stacker truck through tight aisles to retrieve the parts needed; often reaching above their head or stretching to reach the back of the rack to get the part. “We were using every inch of
floor space for storage,” said Dana Denbow, Vice President at Schlumpf, “Parts were hard to access and the process was very time consuming.”
Internal Expansion With no room to grow, Schlumpf
installed one Element Vertical Lift Module (VLM) from Kardex Rem- star, which provided the growth
t the manufacturing level, han- dling large rolls of product packaging presents quite a
needed without a building expansion. In fact, the first Element VLM was working so well that the company added second unit. The inventory in both VLMs was previously stored on pallet rack and
VLM vertical storage carousel.
drawer cabinets that occupied 20 feet by 30 feet of floor space. Using the VLMs Schlumpf was able to recover 474 square feet of floor space (reduced from 600 square feet to 126 square feet), a 79 percent floor space savings. With this recovered floor space, Schlumpf reorganized the manufac- turing flow to maximize efficiencies. “The space we’ve saved with the VLM
Continued on next page
REFLOW SOLDERING SYSTEMS
CONDUCTION + CONVECTION HEAT
Reflow Soldering & Curing Applications include:
• BGA Reballing • BGA Packaging Falcon 5/C • Die/Heat Sink Bonding
• High Density Packaging/Substrates • Laminated Power Components
• Laser Diode Reflow • Lead Frames • Microwave Hybrids, Fluxless Au/Sn Reflow • Extremely Low O2 ppm Capability w/low N2 Consumption SIKAMA INTERNATIONAL, Inc. 118 E. Gutierrez Street • Santa Barbara, CA 93101-2314 U.S.A.
Tel: 1-805-962-1000 • Fax: 1-805-962-6100 •
sales@sikama.com •
www.sikama.com See at IMAPS Booth 816
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