September, 2013
www.us-tech.com
Page 63 MPM Compact Printer Boosts Throughput
Franklin, MA — Electronics manufacturers with high volume demands and floor space at a premi- um are increasingly employing Back-to-Back (BTB) configurations for their PCB assembly equipment, to maximize space efficiency without sacrificing throughput. The Dual Lane BTB-con- figurable MPM Momentum Compact printer satis- fies both, and in addition, delivers high speed and high accuracy to maximize yields and product quality. According to the company, the Momentum Compact delivers the highest throughput for its footprint in the industry. Back-to-Back processing allows a manufac-
turer to fit more lines in a given factory footprint. It is most often used by makers of consumer elec- tronics, and automotive manufacturers. For BTB, the Momentum Compact is supplied in Dual Lane configuration and can be equipped with optional shuttle conveyors. When coupled with two SPI sys- tems and mounters in a dual lane BTB configuration, the result is a line capable of independent produc- tion in each lane. The printer is designed with the potential for BTB setup, as full accessibility for service and maintenance is provided from the front of the machine, as is its unique slide-out solvent reservoir. The unit is 30 percent smaller
overall than the standard Momen - tum, and can be equipped with the MPM EnclosedFlow™ enclosed media printing system, a patent pen -
High-Current Contacting Tip from INGUN
Konstanz, Germany — With the High- current Contacting Tip HK-2504 INGUN Pruefmittelbau GmbH is launching another innovative product for contacting in high-current applica- tions. While the design of the HK- 2504 is similar to the series HK-2501, additional measurement tasks can be
ding solution offering superb fine pitch printing results with paste volumes over 50 percent for 150
micron apertures with a 0.35 area ratio and more than 50 percent materials (paste) savings over metal blades. Stand-alone or in-line, the Momen tum Com -
pact uses the SPI Print Optim izer, which monitors and auto-corrects X, Y, and Q registration “on the fly” to prevent print defects. The printer is equipped standard with RapidClean™, the company’s high- speed stencil cleaning solution that can save up to $10,000 USD in wiper paper per year. Options include Edgeloc™ board snugging, Auto Paste Dispenser, Paste Height Monitor, Enclosed Flow™ Print System, 2D Contrast and Enhanced Inspec - tion, SPI Print Optimizer, Quik-Tool™ Board Sup -
Compact printer can operate back-to-back.
Park, Franklin, MA 02038 % 508-520-0083 fax: 508-520-2288 E-mail:
info@speedlinetech.com Web:
www.speedlinetech.com
port, and AccuCheck™ Print Capability verification. Contact: Speedline Technologies, 16 Forge
High-performance contacting tip.
carried out by using the optional inner-conductor (Kelvin-contact). The diameter of 23mm and the
choice of 51 different contact tips allow reliable contacting of currents up to 100A. The connection is carried
out with an M8 thread. Contact: Ingun Prufmittelbau
GmbH, Max-Stromeyer-Strasse 162,
78467 Konstanz, Germany % +49 7531 8105-0 fax: +49 7531 8105-65 E-mail:
info@ingun.com Web:
www.ingun.com
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