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September, 2013
ASM/SIPLACE Gets New Presence in Silicon Valley
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was to annex adjacent technology, in this case SIPLACE in Germany. This was soon followed by opening the company’s new Americas headquar- ters in Suwanee, Georgia, and now the new technology center in San Jose. A major concept intro- duced by SIPLACE is to keep the customer lines running. This means keeping it running even when changing over the line, performing needed mainte- nance, dealing with break- downs, and knowing where and when there’s a need for operator assist. One of the groups at SIPLACE is totally dedicated to keeping the line running for its customers.
A Maturing Process The event was keynoted by
special guest speaker Sebastian Weckel, Director Manufacturing Solutions at SIPLACE’s head- quarters in Munich, Germany. Weckel talked about technology trends in electronics manufactur- ing, emphasizing that innovation was driving products and trends in SMD and SMT. Such products include mobile devices, cloud technology, au- tonomous vehicles and the Internet of things. Now that the SMT process has matured, a major element in today’s innovation is components that are em- bedded in the PC board. In the mean- time, passive components have be- come ever smaller, as has the spacing between them and the thickness for silicon capacitors. He cited specifically the evolution of the “PICS” high densi- ty trench capacitor and tiny compo-
nents with bottom side-only metaliza- tion. And they keep getting smaller. Active components have also
grown smaller and their contacts more cramped, down to a pitch of 0.3mm for today’s ICs. This has been accompanied by increased numbers
Cutting the ribbon for the grand open- ing of San Jose Technical Center are
(left to right) Hans Morkner, Technica, Jeff Timms, CEO of ASM Americas, Frank Medina, President of Technica, and Thomas Mair, CFO, ASM Americas.
of chip embedding and dual chip sys- tem-in-package designs.
Odd Shaped Components The number of machine-placed
odd shaped components will grow as manual placement becomes too cost- ly and will not be allowed in certain industries. Concurrently, OSCs will be taller and larger — especially in automotive applications. For shrink- ing mobile products, OSCs will be- come smaller and more fragile.
Continued on next page
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