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September, 2013 TE Introduces Highly Flexible Wire
Harrisburg, PA — TE Connectivity (TE) has introduced its new FDR25S wire — a flexible diesel-resistant power cable that is designed for com- mercial and military aerospace, mili- tary ground systems, and military marine industries. The highly flexible wire helps allow the cable to be bent and routed in extremely tight areas while helping to prevent wrinkling
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and cracking of the insulation. This results in the ability to run shorter distances, reducing the stress on the contact and reducing the mating and demating forces normally associated with various connectors. The wire’s ability to route in tight spaces may allow for a larger American Wire Gauge (AWG) size and eliminate the need to split power. According to the company, the
new wire is among the most flexible power feeders available in the mar- ket. The combination of the flexibili- ty and durable radiation cross-linked insulation gives it an excellent bal- ance of properties, allowing it to be what is believed to be an excellent
deicing fluids. The wire is made with a polyester-based material and has tin-plated conductors that help pre- vent the oxidation of copper. These high quality electrical and mechani- cal properties meet high-voltage and high-amperage requirements in a number of applications. The wire’s thermal capabilities
include operating from –55 to +125°C. The wire offers stability for up to 168 hours at 150°C, and bends
for four hours at –55°C. Contact: TE Connectivity/Tyco Electronics Corp., 1050 Westlakes
Drive, Berwyn, PA 19312 % 1-800-522-6752 Web:
www.te.com
SSEC Intros Single Wafer Wet Processing Solutions
Horsham, PA — Solid State Equip- ment LLC (DBA SSEC), a provider of single wafer wet processing systems used in the manufacture of semicon- ductor devices, high-brightness LEDs, and hard disc drives, has in- troduced its WaferEtch and Wafer- Storm product lines. The WaferEtch platform is an
aqueous-based, customizable plat- form configured to meet the needs of specific etch applications for 3D ICs, MEMS, and compound semiconduc- tor processes. These systems use a wet etch process chemistry that
demonstrates optimal etch rate and in situ cleaning. The flagship of the WaferEtch
See at IMAPS Booth 300
platform, the TSV Revealer, is specifically configured to address the requirements of TSV reveal, which is the process where the backside of the wafer is thinned to reveal the copper interconnects. It has become a target area in the manufacture of 2.5D and 3D IC packaging for process control and cost reduction. The product re- places three tools required for the dry etch approach: plasma etch, sili- con thickness measurement, and clean. An optical end point detection system with advanced algorithms determines when vias are revealed. Integration of a wafer thickness measurement sensor in the etch sys- tem provides closed-loop control of the etching process. The WaferStorm platform is a
solvent-based platform, initially available in three unique configura- tions: TSV Cleaner, Metal Lifter, and Dry Film Remover. All Wafer- Storm systems are based on the com- pany’s special soak and spray tech- nology, which provides improved performance at lower cost than con- ventional wet bench-only or spray- only approaches. The process com- bines equal soak time in the wet buffer tank for each wafer, followed by spray, and then a final step de- pending on the process being per- formed. This unique combination minimizes both spray time and chemistry use, and adds a significant level of process control. The reduc- tion in spray time results in in- creased throughput. TSV clean is a critical process
step that is essential to reliability. The deep reactive ion etch (DRIE) process leaves behind a polymer residue which can lead to defects and voids in the barrier, seed, and fill steps that follow. SSEC’s Wafer- Storm TSV CLEANER is proven to remove residues in high-aspect-ratio holes that wet bench-only or spray- only tools leave behind. The tool fea- tures equal-time soak software for
process control. Contact: Solid State Equipment,
LLC, 185 Gibraltar Road, Horsham, PA 19044 % 215-328-0700 fax: 215- 328-9410 E-mail:
info@ssecusa.com Web:
www.ssecusa.com
candidate for installation in tight spaces in and around less forgivable objects in ground vehicles, engines and aircraft. Able to help withstand high-
amperage and high-voltage condi- tions, the FDR25S wire is fluid and arc resistant, which includes resist- ance to diesel fluids, hydraulic fluids, lubricating oils, cleaning fluids and
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