Page 56
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X-Ray Inspection Continued from page 52
Finding Defects Hidden solder joints or bottom
Energy Storage Power line
www.multi-contact-usa.com Industrial Connectors
terminated connections (BTC) are one of the key decision factors for deploying x-ray inspection equip- ment. In contrast, AOI systems are suitable for inspecting BGAs, QFNs, package-on-package (POP) devices, pin-in-paste barrel fill, devices under shields, and heal fillets on gull-wing devices. POP devices pose the same issues as DSAs. Inspecting each package sep- arately requires a recon- struction techniques to sepa- rate the two packages and then horizontally cross-sec- tion them to independently test the top package from the bottom package. The 3D- SART technique produces high-quality images with low artifacts in all of these chal- lenging inspection cases. Using a 2D transmission x-ray
mode, head-in-pillow (HIP) defects cannot be properly detected. Until recently, trying to find HIP defects required horizontal cross-sectioning reconstruction methods. These methods do not adequately ensure HIP detection as other complications arise, namely finding the top surface of the board consistently and the resulting shadows due to reconstruc- tion techniques. But Matrix has developed a robust HIP detection simply using off-axis (2.5D) imaging
September, 2013 Technologies Automate
views and specific polar coordinate algorithms to measure HIP features which were identified to correlate to strong HIP defect detection. Filling degree is an important
parameter to control for pin-in-place (PIP) or thru-hole connectors. Using advanced algorithms which work from off-axis (2.5D) images, the MatriX PIP algorithms can measure
Digital tomosynthesis (DT) uses digital processing to improve top and bottom PCB image quality.
the filling level throughout the entire barrel as well as the top side and bot- tom segments following IPC-6010 specifications (which require a mini- mum filling level of 75 percent). In short, AXI Technology is evolving to help SMT assembly manufacturers better meet their inspection needs. Contact: MatriX FocalSpot, 9915
Businesspark Ave., Suite A, San Diego, CA 92131 % 858-536-5050 fax: 858-536-5054 E-mail:
sales@focalspot.com Web:
www.focalspot.com r
-- Multi-GHz Package Testing Continued from page 53
and an acceptable range was defined as –50 to +150°C.
Electrical Characterization For these socket interfaces, elec-
Battery Cable Connector (BCC) for Energy Storage!
Contact us or visit us!
See us at: The Battery ShowBooth #B1644
trical requirements are generally stat- ed in terms of bandwidth and current carrying capacity. Current carrying capacity is determined by injecting drive current in steps of 10 mA to a maximum value of 5 A. The tempera- ture rise as a function of resistance is measured with a dwell time of 3 min- utes per data point, to allow tempera- tures to stabilize. A temperature rise of 14°C was found for 4 A continuous current. For a test engineer, this indi- cates that the socket will exhibit no Joule heating effects due to the con- tact’s base structure. A final test of bandwidth was
made to determine if a contact tech- nology was suitable for a particular test application, using a commercial vector network analyzer (VNA) for the measurements. A test signal was sent from port 1 (the top of the contact) and received at port 2 (the bottom of the contact) to measure bandwidth. The measured insertion loss of 1dB at 40GHz is attributed to 90 percent of the signal passing through the inter- connection medium and only 10 per- cent of the signal being lost at the interconnection transition at 40GHz. For anyone using high-density
wafer-level packages (WLPs), a pri- mary concern is that a socket must provide high electrical performance, with low, stable resistance, and still
Innovative Socket Technology
meet the mechanical mating require- ments, such as low mating force and a high number of mating cycles with- out performance degradation. As the measurements show, the SM GHz Sockets satisfy the requirements for reliable, high-performance test sock- ets and are suitable for high-speed,
Insertion loss for the contacts was measured as only 1dB at 40GHz.
high-density, high pin count applica- tion needs. The simple design of the socket makes it cost efficient and allows assembly to the target board using existing hardware. A unique feature of this socket is its separable components that can be easily replaced and reused. Contact: Ironwood Electronics,
1335 Eagandale Court, Eagan, MN 55121 % 800-404-0204 or 952-229- 8200 fax: 952-229-8201 E-mail:
info@ironwoodelectronics.com Web:
www.ironwoodelectronics.com r
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