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www.us-tech.com
February, 2018
Machine Vision Products: Designing the Future’s Inspection Machines
By Paul Groome, Semiconductor Business Director, Machine Vision Products
simply didn’t exist. The majority of manufacturing was through-hole, the i486 was the main computing platform and Windows 3.1 was flashy and new. Dr. George T. Ayoub built the company when no one had seen a smartphone, flatscreen TV, mp3 player, solid state drive, GPS system, hybrid car, digital photograph, and many other technologies ubiquitous today. And, who could foresee the impact that the Internet would have?
W
hen Machine Vision Products, Inc., (MVP) was founded 25 years ago, cell phones were in their infancy and portable electronics
ponent assembly. But, moving forward, resolutions in the single-digit micron range will be required for key electronic hardware. The next generation of chip components are
challenging SMT inspection with geometries of 5 mil (125 µm) and solder fillets below 1 mil (25 µm). Even thermal expansion on a board can change the position of these components dramatically, so spe- cial registration techniques will be required. MVP, with its 2020, 850, Spectra, and Ultra platforms, is well-positioned to deliver the solutions for this next level of integration.
Into the 2020s Key goals for any manufacturer
are to increase quality at the most criti- cal stages of manufacturing, increase yields and decrease costs. Although the 10 times rule for the cost of identifying a defect at each stage is less accurate as time goes on, the concept is still true. Using the automotive industry as
an example, finding a defect at the lead frame process may cost less than $1. Finding one during SMT assembly may cost between $10 and $300. Finding a
1993 — i486 motherboard: PGA processor, dual inline through-hole, through-hole passives, QFP, J-lead.
In 1993, cell phone usage in the U.S. had
risen to 11 million users, whereas by 2017, 81 per- cent of the population, approximately 265 million people, had cell phones. At the time, the Sparc processor — MVP’s original computer of choice — had 0.8 million transistors. Today, the Xeon processor used in MVP’s systems contains up to 7.2 billion transistors. When the company was found- ed, there were only 50 Internet (www) servers worldwide. Now, more than 50 percent of the world’s population has access to the web. The rate of change in technology and man-
ufacturing in the electronics industry has been exponential. Famous for his prediction of the doubling of the number of transistors in ICs approximately every two years, Intel’s former president, Gordon Earle Moore, should be proud.
New Challenges Ahead MVP has always endeavored to provide
innovations, solutions and capabilities to meet the needs of the rapidly-changing market. These include statistical process control (SPC) for AOI, SPI and 3D AOI, multi-spectral lighting, multi- camera inspection, wirebond inspection, and die metrology. In the early 1990s, a system with 1 to 2 mil
(25 to 50 µm) resolution may have been suitable to inspect a 486 motherboard. In 2017, 0.4 to 0.6 mil (10 to 15 µm) resolution was enough for basic com-
defect in the field can cost between $1,000 and $3,000. Finding defects as early as possible
is critical to providing the highest possible quality at the lowest cost. This is true for all aspects of electronics manufacturing. The 10x rule varies by market and while 10x may be accurate for con- sumer electronics, high-rel products may be 100x and mil/aero 1,000x. Looking toward the next decade, MVP has
expanded its range of systems to meet the future’s new and challenging inspection requirements. The company offers front-end semiconductor process inspection, including wafer, die and post-dice
inspection, packaging inspection, and hybrid and MCM inspection. For SMT assembly, the company offers backplane, solder paste, post-placement, post-reflow, and conformal coat inspection.
Front-End Processes. The latest series of 850 platforms provide fully-automated handling of wafers in film frames for surface and post dicing inspection. Surface damage, FM and edge damage can be identified. These systems can be configured for cleanrooms up to Class 100. The company offers fully-automated handling for wafers in ring frames, top/bottom side inspection, defect mark- ing, and defect mapping.
Back-End Processes. The company’s offering for back-end processes are split between two plat- forms: the 850 and its latest platform, the 2020. These processes cover wirebond, die, edge, surface, FM, eutectic, lead frame, BGA, bump, flux, and
2016 — i5 motherboard: flip-chip process, SMT (to 01005), QFN.
paste inspection. Each solution offers high-resolution telecen-
tric optics, 3D laser inspection, confocal, or 3D pro- jector imaging. This makes these platforms extremely flexible. In addition, the systems pro- vide capable registration tools, allowing dice, wires and substrates to be registered on the fly, with inspection requirements calculated on a part-by-part basis. Throughput and automated handling are
key. Depending on the configuration, the 2020 DWMS is capable of more than 150,000 units per hour. For handling, MVP microelectronics AOI platforms can be configured for lot solu- tions,
including magazine handling, Rate of change in chip components.
inspection. Back-end semiconductor processes include lead-frame and wirebond inspection, die placement metrology, surface and substrate
lifters/indexers, JEDEC trays, waffle packs, and Auer boats. The company’s inline solutions offer both single- and dual-lane processing, strip han- dling and inline wafer handling. MVP can also
provide custom handling solutions for specialized inspection applications.
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