February, 2018
Easton, MD — JTAG Technologies has released the latest version of its Visualizer graphical view- ing tool for board (PCB) layouts and schematics. The software allows users to assess fault coverage data and pinpoint production test faults quickly. Users can import schematic data direct from
Mentor (PADS, DxDesigner, Capture), Cadence, Altium, and Zuken tools, as well as board layout information in ODB++ and many other vendor spe- cific formats. Introduced in this version, the new maps fea-
ture offers a basic test accessibility view at the click of a mouse. The view can be fine-tuned easily by adding a few key component descriptions to the lookup table.
Customizable colors can be added to indicate
test coverage levels or access types and a color- coded schematic can be displayed or printed. Once the design has been optimized for boundary scan test coverage and committed to lay- out, final application development can begin in the JTAG ProVision de- veloper tool. The latest version of Visualizer
adds several new features. A “visual- ize on (test) fail” feature now shows all failing circuit nets on a schematic view, a layout view or both — auto- matically. This feature is great for small-scale production systems, where the operator is also responsi- ble for fault diagnosis and rework.
Alpha: Solder Preforms for Consistent Bondline Thickness
Somerset, NJ — Alpha Assembly So- lutions has introduced its ALPHA® TrueHeight® solder preforms, which are engineered with embedded spac- er technology. This technology is de- signed to address all major applica- tions that require bondline thick- nesses of 3 mil (75 µm) and greater.
JTAG Visualizer graphical viewing tool.
www.us-tech.com
A “locate next” feature allows the user to track the course of a net connection through the
Page 39 JTAG Visualizer Adds Features for Faster Debug
layers of a PCB layout or the sheets of a schemat- ic. Multiple color themes can be defined to distin- guish different net classifications, e.g. for percent- age fault coverage in schematics or fault nets in layouts.
Operators can now view through layers. A
highlighted fault net, perhaps as a result of a de- tected board connection fault, can now be viewed along its entire path and as it changes course through the PCB layers. Notes can now be added anywhere at a fixed
position on the schematic or layout. This is useful for conveying additional information about test
processes or passing design details between users. Contact: JTAG Technologies, Inc., 111 N
West Street, Suite A, Easton, MD 21601 % 410-770-4415 fax: 410-770-4774
E-mail:
info@jtag.com Web:
www.jtag.com
The only constant in manufacturing is change.
So why should your dispensing and coating process remain static?
Move your process FORWARD.
ALPHA TrueHeight solder preforms.
The preforms are designed to be
simple and easy to implement, while maximizing solder performance. The architecture of the design not only addresses the bondline thickness re- quirement, but also reduces the op- portunity for voiding. When com- pared with other technologies, the design minimizes areas where gases can be trapped during the reflow process. The preforms have the advan-
tage of flexible spacer positioning, so strategic locations can be chosen to ensure consistent bondline thick- ness. The preforms can also be flux
coated with a wide selection of fluxes. Contact: Alpha Assembly Solu-
tions, 300 Atrium Drive, Somerset, NJ 08873 % 908-791-3045 fax: 908-791-2399 E-mail:
laurie.kneller@
alphaassembly.com Web:
www.alphaassembly.com
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Nordson ASYMTEK understands the needs of those in electronics packaging and assembly. We offer affordable, efficient productivity solutions backed by our unequalled application support. Drawing on decades of accumulated experience, we are able to provide our customers with capable yet affordable tools to enhance workflows and improve end products.
QUANTUM High-value automated dispensing system – uncompromising quality, value and productivity for in-line and batch fluid dispensing applications.
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