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www.us-tech.com
February, 2018
Cornell Dubilier (CDE) Highest-Density Capacitors Now Available
Liberty, SC —Cornell Dubilier Electronics (CDE) has launched its THA and THAS series Thinpack capac- itors, which contain the company’s highest-density, low-profile aluminum electrolytic technology. The 185°F (85°C) THA series Thinpack capaci-
tors are only 0.3 in. (8.2 mm) thick, while the 221°F (105°C) THAS series capacitors are 0.35 in. (9 mm) thick. This is comparable in height to V-chip elec- trolytics, tantalums and board-mounted axials, yet offer much higher bulk storage energy density. A single THA/THAS capacitor can replace
many SMT, axial or radial aluminum electrolytic or solid tantalum capacitance arrays. By substituting these devices, engineers can design smaller products
THA/THAS series Thinpack capacitors.
with simpler assembly and higher reliability. Unlike cylindrical electrolytics, THA/THAS
capacitors have sealed, laser-welded, aluminum cases that eliminate the need for space-wasting end seal gaskets. The design includes a valve to vent hydrogen gas, reducing swelling by relieving internal pressure. These capacitors can offer significant cost,
weight and space savings over a comparably rated bank of SMT or axial aluminum electrolytic capac- itors. This includes requiring about 70 percent less board space than alternatives, resulting in a reduction of overall board size and weight. The use of a single component, instead of many, and fewer connections improves over- all circuit reliability. The THA is rated at 3,000 hours of life at 185°F (85°C), while the THAS is rated at 3,000 hours of life at 221°F (105°C). Values range from 140 µF at 450 VDC to 18,000 µF at 10 VDC, with 72 different capacitance/voltage combinations
available for each series. Contact: Cornell Dubilier
Electronics, Inc., 140 Technology
Organize and take control of your documents
YUDU’s mobile Document Center App can provide employees and customers with a single destination from which to access brochures and catalogs to user manuals and datasheets.
Place, Liberty, SC 29657 % 864-843-2626 Fax: 864-843-2402 Web:
www.cde.com
XMOS Adds to Its Far-Field Voice Capture Solutions
Hampton, NH — XMOS is now offer- ing its xCORE VocalFusion speaker linear evaluation kit as part of its range of far-field voice capture solu- tions. Based on the XMOS Vocal - Fusion XVF3100 voice processor, the kit is designed for developers who integrate voice interfaces into flat or linear consumer electronics for pro- cessing by a cloud-based speech recognition system or local applica- tion processor, even in complex acoustic environments. The XVF3100 voice processor
delivers sophisticated voice digital signal processing (DSP) including a full duplex acoustic echo canceller (AEC) with barge-in capability that enables users to interrupt or pause a device that is playing music, and an adaptive beamformer that follows the speaker.
Can sit across iOS, Android and Windows devices for full platform ubiquity
Properly categorize all of your content, from brochures and catalogs to user manuals.
Tight version control, so that older documentation is never presented to users of the app.
VocalFusion speaker linear evaluation kit, XK-VF3100-L33.
Provide a truly responsive, smartphone friendly viewing mode for smartphone users, called PhoneView.
Permission management to make sure you can control
who sees what documents. For more information
888 367 9838
Enhanced search options for easy discoverability among readers.
With support for Sensory’s
TrulyHandsfree™ keyword trigger technology, the XVF3100 provides a flexible and cost-effective, always-on
voice interface in a single device. Contact: XMOS, 1 Merrill
Industrial Drive, Suite 6, Hampton, NH 03842 % 617-500-0353 E-mail:
press@xmos.com Web:
www.xmos.com
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