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www.us-tech.com


February, 2018 ®


BOOTH # 38 2 5


ClassOne Slashes Compound Semi Via Liner Plating Costs


Kalispell, MT — ClassOne Technolo- gy has developed a new plating tech- nique that provides significant cost reductions for compound semicon- ductor manufacturers who use gold- plated vias. According to the company, imple-


with


menting copper plating on the Sol- stice ECD system with the Clas- sOne’s CopperMax™ chamber re- duces costs dramatically. These re- ductions can be as much as 70 per- cent in metallization costs, com- pared with the previous approach. The new savings result not


Enabling Industry 4.0ry 4 CONNECTIVIT Y


MATERIAL CONTROL TRACEABILIT Y ANALY TICS


TROL 4.0 cogiscan.com 14:27


just from replacing the bulk of the gold with copper, but also from the additional copper-plat- ing efficiencies made possible by the CopperMax chamber design. Consumables have been the largest single-cost factor in cop- per plating, because the process typically requires large volumes of expensive organic additives over the lifetime of the bath. But now, by employing a cation-exchange membrane to separate anolyte from catholyte, the CopperMax chamber effectively isolates additives from the anode, drastically reducing additive depletion, and therefore usage. And since the CopperMax bath remains clean much longer, bath life is ex- tended by 15 to 20 times, resulting in increased uptime and throughput. CopperMax also reduces copper


anode expenses. Instead of solid, ma- chined copper material the new cham- ber is able to use less expensive bulk


anode pellets, cutting anode costs by over 50 percent. Since the pellets pro- vide much greater surface area, maxi- mum plating rates can be increased. In addition to the process im-


provements, the net result is a very significant reduction in cost per


Solstice S8 electroplating system.


wafer. Compared with previous cop- per processes, the CopperMax cham- ber reduces additive consumption by over 95 percent, resulting in an over- all cost of ownership reduction of al- most 50 percent. And, for users who switch from gold to copper via liners and do the plating on a Solstice sys- tem with CopperMax, the costs are


cut by roughly 70 percent. Contact: ClassOne Technology,


109 Cooperative Way, Kalispell, MT 59901 % 406-407-7814 E-mail: info@classone.com Web: www.classone.com


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