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Page 64


www.us-tech.com


High mass, heat-sinking, lead-free PCBs have met their match.


PACE introduces the PH 100 low profile IR preheater for the most challenging PCBs


The PACE PH100 is a high powered (1600W), non-contact infrared heating system with an ergonomic, low-profile design which permits operators to safely pre-heat PCBs for fast, efficient soldering, rework or repair


Features:


• Sleek, incredibly low working height improves operator comfort and reduces fatigue, perfect for under microscope


• Intuitive 3.5" resistive Touch Screen Display for all operations • Large 300mm x 300mm (11.8" x 11.8") heating area


1-877-882-7223 www.paceworldwide.com


August, 2017


Optimal Electronics CEO to Present at NEPCON


Austin, TX — Optimal Electronics founder and CEO Dr. Ranko Vujosevic will be presenting a white paper entitled, “Lights Out Elec tronic Assembly” on August 29th, at 11:40 a.m. Lights out electronic assembly is the ability to run PCB assembly lines unattended by operators for an extended period of time. The advan- tages of this sort of manufacturing include increased productivity, reduced labor and energy costs and increased customer satisfaction as a result of quicker product delivery. The paper describes the chal-


lenges faced in achieving lights out assembly. It also proposes the use of various technologies to reach that goal, also discussing the design of an electronics assembly line that can run without operator intervention.


Dr. Vujosevic founded Optimal


Electronics in 1996 and remains the visionary behind the value Optimal Electronics brings to its customers. By working directly with customers to understand their most difficult challenges, he guides the company’s engineering team to translate those requirements into solutions. Prior to founding Optimal he worked as a research scientist at the University of Iowa’s Center for Computer Aided Design.


Contact: Optimal Electronics Corp., 13915 Burnet Road, Suite


312, Austin, TX 78728 % 512-673-7297 E-mail: ranko@optelco.com Web: www.optelco.com


See at NEPCON South China, Booth 1T11


Vi Exhibits 3D AOI and SPI Systems


Soldering, Desoldering and Rework Solutions Since 1958.


Richardson, TX — Vi Technology’s new 5K3D is a 100 percent 3D AOI system, based on laser technology with angled cameras. The patented AOI technology com- bination is designed to offer complete defect coverage with high-precision metrology. The company’s PI series 3D SPI provides a range of benefits, such as programming-free software and excellent accu- racy for small pads. These two measurement systems togeth- er form a prerequisite for actionable data and process control. The PI series has been recog-


SIGMA Link process improvement software. SIGMA Link, coupled with the company’s inspection systems,


Vi’s 5K3D images are generated by laser technology and angled cameras.


nized by the industry as an innova- tive SPI product, since the introduc- tion of moiré systems. With 360° moiré technology, the PI series gen- erates an extra-large 3D image for easy review and excellent accuracy. According to the company, PI is the only inspection system to program automatically. The company also offers its


creates an integrated solution for optical inspection, and provides a smart interface for SMT process


improvement. Contact: Vi Technology, Inc., 903 N Bowser Road, Suite 202,


Richardson, TX 75081 % 972-235-1170 E-mail: sales.americas@vitechnology.com Web: www.vitechnology.com


See at NEPCON South China, Booth 1F55


C&K Develops Micro-D Lightweight Backshell


Newton, MA — C&K has developed a new micro-D lightweight backshell product. Micro-D lightweight back- shells are a key element in protecting Micro-D connectors and cables in space applications that have tight weight and space constraints, such as satellite harnesses, payload equip- ment and launchers. The backshells are designed to


be easily integrated in environments that require designers to optimize weight and space. According to the company, these products are the only ones on the market to be certified by the ESA (European Space Agency) through the ESCC (European Space Components Coordination), meaning that they can be used in any style of space engineering project. The products are designed to


accept micro-D connector sizes 9, 15, 21, 25, 31, 37, and 51 points, and are available in nickel- and gold-plated versions, with four types of outlets


(top circular, top elliptical, 45° circu- lar and 45° elliptical) for flight and engineering models. The backshells


Micro-D lightweight backshell.


are compatible with 3401/032 acces- sories and 3401/029 or 3401/077


micro-D connectors. Contact: C&K, 15 Riverdale


Avenue, Newton, MA 02458 % 617-969-3700


Web: www.ckswitches.com


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