September 2025
www.us -
tech.com
Page 77 Essemtec: All-in-One Assembly and Dispensing
AESCH, SWITZERLAND — Essemtec is now offering a range of high-performance, all-in-one platforms. The FOX Ultra deliv- ers placement speeds of up to 31,000 components per hour (CPH) in a compact, high-preci- sion platform ideal for high-mix, low- to mid-volume production. The PUMA Ultra offers up to 30,000 CPH while supporting a broader range of applications and configuration options. Both platforms combine
KYZEN: Precision Cleaning with Intelligent Control
NASHVILLE, TN — KYZEN offers a wide range of cleaning technologies — from underside wipe to advanced process control. KYZEN E5631J understencil
cleaner is a cost-effective, ready- to-use solution specifically de - signed for stencil cleaning applica- tions. It is compatible with lead- ing stencil materials, cleaning equipment, and printer platforms. E5631J rapidly removes all types of raw solder pastes, supporting im proved yields and cleaner prints in demanding production environments. AQUANOX A4618 is KY -
ZEN’s latest generation aqueous cleaning chemistry, engineered to remove lead-free and no-clean flux residues from printed circuit as - sem blies. Safe for multi-pass clean ing and designed with an enhanced stabilizer package, A4618 provides consistent per- formance and long bath life — ideal for high-reliability sectors where performance and reliability are critical. The KYZEN ANALYST2 is
an advanced online concentration monitoring system. Built on more than 250 global installations and enhanced by customer feedback, the ANALYST2 uses proprietary sonic velocity technology for real- time, direct concentration meas- urement. Unlike reflective-based devices, ANALYST2 delivers pre- cision to 0.1% resolution and is unaffected by liquid conductivity, color, or transparency. Compat - ible with more than 60 cleaning chem istries, ANALYST2 offers an intelligent, efficient way to main-
tain process stability. Contact: KYZEN, 430
Harding Industrial Drive,
Nashville, TN 37211 % 615-831-0888 E-mail:
sherry_stepp@kyzen.com Web:
www.kyzen.com
See at SMTA Guadalajara, Booth 502, The Battery Show, Booth 1628, and SEMICON West, Booth 936
high-speed solder paste jetting, advanced pick-and-place, and integrated 2D SPI and AOI inspection into a single machine — maximizing performance with- out compromising flexibility. These systems are purpose-built for today’s most complex assem- bly needs, including SiP, PoP, and SoP technologies. Essemtec is also offering
dispensing and jetting valve technologies, featuring five pro- prietary valves that support a wide range of fluidic materials — from glue and epoxy to solder paste, UV adhesives, and silver-
filled materials. These solutions support advanced applications such as underfill, dam and fill, 3D dispensing, and jetting in cavities or on multiple Z-levels.
With a focus on automation,
accuracy, and flexibility, Essem - tec continues to lead the way in high-mix SMT production — delivering the tools manufactur- ers need to stay ahead in an increasingly complex and com-
petitive market. Contact: Essemtec AG,
Mosenstrasse 20, CH-6287,
Aesch, Switzerland % +41-41-919-60-60 E-mail:
essemtec.info@
nano-di.com Web:
www.essemtec.com
FOX Ultra all-in-one system.
See at SMTA Guadalajara, Booth 802
CREATE YOUR Connections
Rehm at productronica – Let’s Connect!
Rehm Thermal Systems is an expert in connection technologies for electronics manufacturing. With innovative system solutions for soldering, drying, and coating, we empower our customers to create their own reliable connections on electronic assemblies – customized, process-secure, and future-oriented.
Create your Connections – with Rehm, you shape the connection technology of tomorrow.
We look forward to connect with you in Munich!
www.rehm-group.com See at SMTA Guadalajara, Booth 926
productronica 2025
Nov 18 - 21, 2025 Munich, Germany Booth A4.335
We look forward to seeing you!
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