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Page 74


www.us - tech.com


September 2025 MIRTEC Displays Next-Gen 3D Inspection


ADVANCED SILICONE FOAM FOR ELECTRONICS & EV BATTERY PACKS DESIGNED TO:


 Reduce weight  Mitigate thermal runaway


 Protect from moisture, debris, vibration, and shock


Watch live product demonstrations at The Battery Show, booth #5612.


cht-silicones.com See at The Battery Show, Booth 5612


OXFORD, CT — MIRTEC will showcase its full portfolio of advanced 3D AOI, SPI, and smart factory automation solutions at SMTA Guadalajara. MIRTEC’s flagship anti-reflection technology (ART) 3D AOI system is the world’s first 75 MP multi-camera full HD 12 projection inspection platform. It combines five 15 MP CoaXPress color cameras with proprietary moiré projection to deliver reliable inspection of reflective objects, such as solder joints in automotive, aerospace, and defense applications. GENESYS-CC is a high-res-


olution conformal coating AOI system with a 15 MP camera, 15 µm lens, and tri-stage UV light- ing including coaxial lighting. With optional 4 µm optics, it detects 30 µm bubbles with exceptional accuracy. TAL 3D SCAN is a pre-


inspection laser module that enables 3D measurement of com- ponents up to 2.76 in. (70 mm) tall without Z-axis movement. It integrates seamlessly with the MV-6 OMNI and improves pro- ductivity by up to 30% for THT/SMT mixed assemblies without compromising speed. MIRTEC’s MV-6 OMNI


inline 3D AOI system is config- ured with a 15 MP CoaXPress main camera, four 18 MP side


 


 


  





cameras, and digital blue moiré projection. It offers Z-axis move-


ART 3D AOI system.


ment to inspect components up to 1.57 in. (40 mm) in height and can optionally include a built-in flipper for dual-sided PCB inspection. The MV-3 OMNI is a com-


pact benchtop 3D AOI system supports 2.76 in. (70 mm) top and 3.94 in. (100 mm) bottom clearance, ideal for high-clear- ance components in automotive or defense electronics. It features tri-frequency moiré projection


and Z-axis adjustability. Contact: MIRTEC Corp., 3


Morse Road, Oxford, CT 06478 % 203-881-5559


E-mail: ekim@mirtec.com Web: www.mirtec.com


See at SMTA Guadalajara, Booth 302, and SEMICON West, Booth 1955





   


 


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