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September 2025


www.us - tech.com


TEWSKBURY, MA — Axxon-Mycronic is now offering a full lineup of cutting-edge coating, dispensing, and backend solutions designed to protect electronic devices in even the harshest environments. As electronics are increasingly deployed


in extreme conditions, reliable protection against environmental and mechanical stress is paramount. Axxon-Mycronic’s innovative systems provide conformal coating and back- end dispensing capabilities, ensuring devices maintain durability and performance. At the forefront of Axxon-Mycronic’s offer-


ings is the MYC50 Coating Line, a high-per- formance solution for conformal coating appli- cations. Designed to apply precise, thin protec- tive layers to printed circuit boards (PCBs) and electronic components, the MYC50 helps guard against mois- ture, dust, corrosion, and other environmental threats. By pre- venting damage from harsh condi- tions, the MYC50 ensures long- term reliability and functionality for electronic systems. The MYC50E backend dis-


pensing system elevates electron- ics protection by delivering pre- cise applications of RTVs, potting compounds, TIMs and other large material volume applica- tions. This system is engineered


Epic Resins to Exhibit at The Battery Show


PALMYRA, WI — Epic Resins, a leading manufacturer of epoxy and polyurethane resins, is excit- ed to announce that it will be exhibiting at The Battery Show and Electric & Hybrid Vehicle Technology Expo North America. With over 1,300 suppliers


exhibiting cutting-edge solu- tions, attendees will benefit from a five-track conference offering in-depth presentations on ad - vanced battery design, manufac- turing development, and the evolving market supply chain and regulatory landscape. Visit Epic Resins to explore


its range of epoxy and poly - urethane materials, including encapsulating compounds for electric vehicles, thermal man- agement solutions, and light- weight battery potting com- pounds. Attendees will have the


opportunity to meet with Epic Resins’ technical experts to dis- cuss innovative material solu- tions for electric and hybrid vehi-


cle applications. Contact: Epic Resins, 600


Industrial Boulevard, Palmyra, WI 53156 % 262-495-3400 E-mail: kbrown@epicresins.com Web: www.epicresins.com


See at The Battery Show, Booth 2818


See at SMTA Guadalajara, Booth 310 and SEMICON West, Booth 5745   www.nordson.com/TestInspect MYC50 conformal coating system.


to protect components from mechanical stress, vibration, impact, heat and other detrimental conditions reducing the risk of


Page 59 Axxon-Mycronic Showcases Advanced Coating


failures due to environment or use. With sup- port for single and two-part materials, the MYC50E is versatile enough to meet the evolving demands of modern manufacturing processes. Axxon-Mycronic’s MYD10X underfill


system is engineered to deliver precise underfill applications, critical for high-relia- bility electronic assemblies. This system also ensures void-free encapsulation for sensitive components, enhancing their durability and


Road, Tewksbury, MA 01876 % 831-278- 1995 E-mail: jeff.leal@mycronic.com Web: www.axxonauto.com


performance in extreme conditions. Contact: Axxon-Mycronic, 554 Clark


See at SMTA Guadalajara, Booth 650


 SQ3000M2


Automated Optical Inspection and Metrology System


Excellence Achieved: Recognized Leaders in Wirebond Applications including Wirebond Loop Height Measurement.


Nordson’s new in-line SQ3000M2 Inspection and Metrology system, designed for microelectronics applications, provides superior performance with unparalleled accuracy and resolution. The SQ3000M2 is an extension of the best-in-class SQ3000 platform that improves yields, processes and productivity.


Powered by Focus Variation Metrology (FVM) technology and high resolution telecentric optics, the system provides exceptional defect coverage and measurement capabilities. The sensors provide 2D and 3D height measurements for high resolution applications also requiring height measurements. The system is ideal for micro-electronics inspection of various packages like wire bonds including loop height measurement.


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