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September 2025


KONIG Pioneers 3D Digital Coating Solutions for the Electronics Industry


By Wendy Xu, Marketing Supervisor, KONIG


dustry by redefining what’s possible in coat- ing technology. The company specializes in advanced protection for sensitive electronic products, and over the past decade, it has built a reputation for excellence, innovation, and reliability. With over 150 employees and a 30,000 square foot state-of-the-art manu- facturing facility, KONIG supports its global customer base with a comprehensive suite of services centered around 3D digital packag- ing solutions. At its core, KONIG exists to solve one


F


of the most persistent challenges in elec- tronics manufacturing: how to protect in- tricate, miniaturized components while maintaining production efficiency and en- vironmental sustainability. The company’s in-house development of 3D UV-curable glue deposition technology positions it at the forefront of this challenge.


3D Digital Coating KONIG’s flagship solution is its 3D


digital coating system, which is an ad- vanced method that replaces traditional manual or semi-automated conformal coat- ing and masking procedures. This system leverages high-speed, high-precision jet- ting of UV glue in targeted areas to create protective three-dimensional structures. By using computer-controlled deposition and


KONIG KP400 3D digital coating system. With a drop frequency of up to 20,000


times per second and an ability to produce ful- ly hardened protection layers within 10-30


ounded in 2010 and headquartered in Suzhou, China, KONIG has carved out a distinct niche in the electronics in-


multilayer stacking techniques, KONIG de- livers a level of detail and adaptability that legacy systems simply can’t match. According to president Jason Zhu, “This


technology fundamentally changes how elec- tronics manufacturers think about protective packaging. We enable faster production, higher precision, and lower cost, all while achieving better protection performance.” Operating at an injection resolution of 400 dpi and capable of producing layer thick- nesses as fine as 15 µm, KONIG’s system is ideal for today’s densely packed, miniatur- ized electronic assemblies.


seconds, the system supports high-throughput production lines without sacrificing quality. By eliminating traditional masking


steps and reducing material usage, KONIG’s technology can lower packaging costs by more than 40%. Masking eliminates over- spray, which is wasted material. The au- tomation also reduces dependence on manu- al labor, contributing to more consistent quality and greater throughput. The digital packaging equipment can be


easily integrated into existing SMT produc- tion lines or tailored into standalone solu- tions, offering flexibility for both high-vol- ume OEMs and specialized contract man- ufacturers. KONIG’s solutions are tailored for a


comprehensive range of applications across the electronics landscape. Its technology has been adopted by manufacturers in:


lSurface Mount Technology (SMT): Espe- cially useful for protecting complex assem- blies post-reflow without interfering with neighboring components.


l Semiconductor Packaging: Delicate chips and wafer-level packages benefit from KONIG’s non-invasive, accurate glue ap- plication that shields without adding ex- cess bulk.


l Consumer and Industrial Electronics: From smartphones to smart appliances,


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