October, 2022
www.us -
tech.com
OSAGE BEACH, MO — Nihon Superior Co. is exhibiting its TempSave™ series low-temperature soldering materials, along with its SN100CV® P608 solder paste. Nihon Superior's TempSave series of low-temperature soldering
materials has been designed to address the industry's goals of reduced peak reflow temperature to reduce defects contributing to package warpage, reduce energy consumption during the reflow process, and avoid potential damage to temperature sensitive devices. TempSave B58 is a eutectic SnBi alloy with a melting point of 282°F (139°C) while TempSave B37 is a ductile hypoeutectic SnBi alloy and does not contain Ag. High bismuth containing alloys are known to be
brittle and therefore poor in drop shock performance. However, TempSave B37 has outstanding drop per- formance, even dramatically outperforming SAC305. The halogen-free P610 flux medium is specifically designed for Bi alloys. The Temp - Save B37 P610 solder paste can be reflowed with a peak temperature of 374°F (190°C). Also, a high speed jetting paste version is avail- able, TempSave B37 P611 which provides consistent dot sizes. SN100CV P608 is a complete-
ly halogen free, lead-free, no-clean solder paste. Unlike silver-con- taining alloys that derive their strength from a dispersion of fine
particles of eutectic Ag3Sn, SN100CV gains its strength from
TT Launches Thin Film High Power
Chip Resistors PERRY, OH — TT Electronics has launched its TFHP series of thin film, high power chip resistors. The TFHP product family com- bines high power and high preci- sion in a single resistor, capitaliz- ing on aluminum nitride (AIN) ceramic substrate with nearly six times the conductivity of alumi- na, the conventional substrate material for chip resistors. This high power density com-
ponent saves printed circuit board (PCB) area and can boost reliability by restricting the tem- perature rise in the component hotspot. It does so thanks to enhanced heat transfer from ele- ment to terminals. Building on TT's expertise
in power chip resistors engi- neered to meet demanding ther- mal management targets, the new TFHP series offers 2W in 1206 and 6W in 2512 chip sizes. In addition, TFHP features large area terminations for improved thermal contact with a PCB. These high-power resistors also offer greater precision than thick film alternatives, delivering 0.1% tolerance, 25 ppm/°C TCR combined with reduced self-heat-
ing to improve linearity. Contact: TT Electronics,
3700 Lane Road, Perry, OH 44081 % 440-352-8961 E-mail:
sales@ttelectronicsamericas.com Web:
www.ttelectronics.com
See at electronica, Hall C3 Booth 120
See at electronica, Hall A3 Booth 459
Page 75 Nihon Superior Highlights TempSave Soldering Materials
solute atoms in the tin matrix of the joint. Although silver-free, in ten- sile tests the SN100CV alloy matches the strength of SAC305 while maintaining a high level of resistance to impact loading. LF-C2 is a high reliability lead-free alloy as it uses both dispersion and solid solution strengthening. With a liquidus temperature of 415°F (213°C) it can be reflowed at a lower temperature than SAC305. The P608 flux medium provides wetting comparable with that of halogen-containing paste even though it is completely halogen-free. SN100CV P608 and LF-C2 both deliver excellent performance over a wide range of component types and process
parameters. Contact: Nihon Superior USA, LLC, 1395
Hawk Island Drive, Osage Beach, MO 65065 % 573-280-2357 E-mail:
k.howell@nihonsupe-
Low-temperature solder paste.
rior.co.jp Web:
www.nihonsuperior.com See at SMTAI, Booth 2735
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