Page 54
www.us-tech.com
October, 2022
Demand for Small Devices: How Industry Trends Affect Connectors
By Bob Stanton, Director of Technology, Omnetics
electronic connector systems. New smaller and more portable electronics in aerospace, defense, and other stressful environments, like those encountered in robotics and oil exploration, are resulting in changing demands and designs. To meet the needs, changes are needed
R
to standard micro-D connectors. New tech- nology, including new latching Micro-D con- nectors developed by Omnetics, offer signifi- cant improvements for rapid connection and release with proven signal integrity for the portable and ruggedized electronics flooding into the market. The new latch technology provides high shock and vibration performance tested at military- level specifications.
Smaller and Lighter It is a fact of life that instru-
ments are changing rapidly and everything is getting smaller. Today’s newer electronic instru- ments can afford neither the space nor the weight required by older cabling and connector systems. Even many of the older mili-
tary specification models are rap- idly becoming outdated in the face of the evolving demand for smaller and lighter connection systems.
Cable types to prevent signal intrusion.
apidly changing demands and designs in product performance and electrical integrity are having a huge effect on
Older connectors like the D-Subminiature connectors (Mil.-DTL-24308), requiring 0.1 in. from pin to pin do not fit within today’s systems. Rapid industry growth in micro-size at 0.05 in. spacing and nano-connectors at 0.025 in. spacing is fulfilling the need in today’s higher technology electronics. The change is sweeping through many
industries as each one in turn sees the bene- fits of rugged portability and miniaturization and adjusts to the need for new connector and cable designs. For example, a number of military and
deep space applications began using robotics and soon we began to see emergency rescue device development companies beginning to use miniature cables and connectors.
Then, since many emergency applica-
tions require the use of devices that can run at higher temperatures, up to 392°F (200°C), we began to see the petroleum research and geothermal industry following suit and test- ing new micro-D connector technology for their applications. In short, squeezing a lot into small
spaces is becoming key across the industry and micro-D connector technology must be available to serve that need. The designers are heralding the ruggedized miniature con- nector as a major solution to a combination of design needs and application-related demands. The trend also includes a need for quick plug-and-release connector technology, because users do not want to have to go back to a lab and use additional tools to mate or release a connector.
Increasing Circuit Complexity As electrical circuit technolo-
gy and complexity evolves, chip speeds are increasing their data processing rates, current and volt- ages are being used at lower levels and mixed signal systems are demanded within the same inter- connect system. The use of these new circuits with higher and high- er circuit speeds are evident near- ly everywhere, but are most criti- cal in surveillance cameras and
Continued on next page
SIMULATION OF THERMAL DISSIPATION ON PCB FOR POWER MODULES
REDEXPERT. Würth Elektronik’s online platform for simple component selection and performance simulation:
www.we-online.com/redexpert
• Simulation of Thermal Dissipation on PCB for Power Modules
• The world’s most accurate AC loss model • Filter settings for over 20 electrical and mechanical parameters
• Inductor simulation and selection for DC/DC converters • Available in seven languages • Online platform based on measured values • Ability to compare inductance/current and temperature rise/DC current using interactive measurement curves
• Order free samples directly • Direct access to product datasheets • Comfortable and clear component selection
WE meet @
electronica Hall A5, Booth 406
See at electronica, Hall A5 Booth 406
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104