Page 62
www.us -
tech.com
October, 2022
Digital Manufacturing on the College Campus By Mark Ogden, Marketing Manager — Americas, ASMPT P
artners for nearly 20 years, ASMPT and the Rochester Institute of Tech - nology’s (RIT’s) Center for Electronics
Manufacturing and Assembly (CEMA) have united the power of industry innovation and the deep discovery of academia to advance electronics manufacturing progress and train the next generation of engineers. This rela- tionship, which began with the first ASMPT equipment installation in 2003, continues to produce beneficial outcomes for both parties and the electronics industry. As manufacturing has seen significant transformation over the past two decades, the ASMPT-RIT collaboration has kept pace with equipment technology, process innova- tion and student development investment. And it continues. Most recently, ASMPT has committed
additional resources to the CEMA lab to sup- port production digitalization, with sophisti- cated software and state-of-the-art equip- ment platforms now accessible for R&D and student training. Some of these new tools have already been integrated into course- work and leveraged as part of process tech- nology study.
Investing in the Digital Future The CEMA lab, which currently houses
leading-edge SIPLACE TX placement tech- nology and DEK printing equipment, will
soon add ASMPT’s just-released, sophisticat- ed DEK TQ L stencil printing platform to the mix. This printer ensures ASMPT onsite engineers, regional customers and RIT stu- dents have cutting-edge technology for research and development initiatives. The fast, feature-rich printer has
numerous capabilities and, in keeping with the company’s “open automation” philosophy,
“With the DEK TQ L, my stencil print-
ing applications work will be supported by state-of-the-art, ultra-precise technology,” he says. “This, in combination with the network- ing robustness of the platform, raises the print quality benchmark, enabling consistent defect-free results on even narrower pitches and spacings. With new equipment and its expansive capabilities, our CEMA-related ASMPT research endeavors can push the boundaries of stencil printing even further.” In addition to digital platform control
RIT’s CEMA lab, which includes ASMPT printing and pick-and-place systems.
is equipped with open and flexible interfaces for advanced line and factory communication protocols, as well as higher-level networking and remote support solutions. ASMPT senior process engineer, Jeff
Schake, who works onsite at RIT, is looking forward to having the latest printing plat- form at his fingertips.
and integration, ASMPT line control soft- ware and offline programming modules were made available this year for training CEMA students on program development. Whereas in the past students working in the lab pro- grammed equipment with one-on-one over- sight for a specific project, an advanced man- ufacturing course integrated SIPLACE Pro into the coursework. Students designed PCBs and then creat-
ed the placement program for them; this is valuable for independent research work and, ultimately, for careers in industry. In addition to students working with the latest-genera- tion networked equipment, adding software training to the course of study is the start of a more accelerated understanding of data use and integration for the smart factory.
RIT’s Dr. Martin Anselm, who designed Continued on next page
FLEXIBLE PRINTED CIRCUIT AND MATERIAL SOLUTIONS
We are an industry leader in materials conversion, production, circuit fabrication,
We provide collaborative product development
sheldahl.com
See at MD&M Minneapolis, Booth 2413 and electronica, Hall A1 Booth 126
See at electronica, Hall B2 Booth 504
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104
