October, 2022
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Page 41 Viscom Showcases Latest Inspection Solutions
DULUTH, GA — Viscom AG is presenting its latest inspection solutions at electronica 2022. Smart condition monitoring, cen- tral and efficient IT management service, high-performance and scalable processing of large data volumes — Viscom will present these topics in the context of its new modular platform vConnect. The use of state-of-the-art meth- ods enables complex manufactur- ing processes to be protected even better than before against unex- pected disruptions and delays. There will also be exciting re-
ports on the practical application of artificial intelligence. Using the classification of inspection results as an example, possibilities will be shown for gradually establishing AI as a reliable co-decision criteri- on in quality control. Another AI focus will be the smart segmenta- tion of voids detected by automatic X-ray inspection. At electronica, visitors will
gain an in-depth insight into Vis- com’s wide-ranging system world. Among other things, the iX7059 PCB Inspection XL will be on dis-
Heatsinks for Electronic Housings
HARRISBURG, PA — Phoenix Contact has increased the breadth and depth of its popular Industrial Case System (ICS) housing family to include both customizable passive heatsinks and heatsink fillers. Advanced components com-
bined with tighter spaces have put increasing thermal demands on electronic housings. New heatsink solutions from Phoenix Contact now allow design engi- neers to choose from a wide range of thermal management solutions to keep their compo- nents from overheating. Passive heatsinks and space-
saving heatsink fillers are avail- able in ICS housing widths of 1 and 2 in. (25 and 50 mm). The po- sition of the heatsink base can vary, making it possible to connect electronic components with an in- stalled height of up to 0.5 or 0.6 in. (13 or 15 mm). The clearance between the
PCB and the heatsink base ranges between 0 and 11 mm, to meet different space require- ments. This ensures optimum heat dissipation in the enclosure and a longer service life of the
electronic components. Contact: Phoenix Contact,
P.O. Box 4100, Harrisburg, PA 17111 % 717-944-1300 E-mail:
info@phoenixcon.com Web:
www.phoenixcontact.com
See at electronica, Hall B3 Booth 103
Streamline costs and operational performance with IO-Link-enabled signaling solutions
play at the booth. The powerful 3D AXI system inspects PCBs up to 63 in. (1,600 mm) in length for solder beads, damage, voids and many other potential defects. An innovative dynamic 3D image ac- quisition process, in combination with user-friendly software, gen- erates complete volumes and indi- vidual CT slice images exception- ally quickly for accurate and re- peatable measurements. Potential applications of man -
ual and semi-automatic X-ray can be demonstrated on the X8011-III 3D MXI system from Viscom. In daily practice, it supports process
optimization and production start- ups, helps in processing com- plaints and is also ideally suited for quality inspections in high-mix low-volume production. Viscom will present a broad range of information about fast
automatic optical inspection, in- cluding all-round smooth han- dling, on its S3088 ultra gold 3D AOI system — which is now used very successfully by customers worldwide. Special features of wirebond inspection will be ex-
plained on the S6053BO-V. Contact: Viscom, Inc., 1775
Breckinridge Parkway, Suite
500, Duluth, GA 30096 % 678-966-9835 E-mail:
info@viscomusa.com Web:
www.viscom.com
Viscom vConnect inspection software.
See at electronica, Hall A3 Booth 642, and SMTAI, Booth 1214
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