April/May 2023
www.us-tech.com
FRANKFURT, GERMANY — With the motto “Driving manu- facturing forward,” SMTconnect, which takes place from May 9 to 11 in Nuremberg, Germany, will offer the European electronic pro- duction community a forum for inspiration and exchange as a basis for the further development of key technologies for the future. Numerous key players in the
industry, including ASYS, Ersa, Essemtec, FUJI, JUKI, Pana - sonic, SMT Wer theim and Viscom, have confirmed their par- ticipation as exhibitors. They will present products and solutions from all areas of electronics man- ufacturing at the Nurem berg exhibition grounds, and exchange ideas on current industry issues such as increased energy costs, component and raw material shortages and obsolescence man- agement, as well as the current reshoring trend to Europe with peers and practitioners. Highlights of the event once
SEMICON West...
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“The program is shaping up to be an incredible lineup, leading each morning with the CEO Summit keynote presentations followed by full days of great con- tent from industry leaders and networking activities.” During CEO summit key -
notes, luminaries will share insights on the chip industry’s progress toward $1 trillion in annual revenue, including the importance of the CHIPS Act funding, as well as new semicon- ductor technology advances and growth segments. Another featured topic is
Path for Talent, which includes creating a diverse and inclusive industry, building a career in microelectronics and cultivating an inclusive talent pipeline. Technology experts will
explore key themes such as advanced wafer technology, sus- tainability in electronic materi- als, the latest trends in sen- sorization, heterogeneous inte- gration, and accelerating the pace of lithography and scaling innovation. The FLEX Conference, the
annual event focused on flexible hybrid and printed electronics innovations, and the Design Automation Conference (DAC), the premier gathering focused on the design and design automa- tion of electronic circuits and sys- tems, will co-locate with SEMI- CON West 2023. Contact: SEMI, 673 South
Milpitas Boulevard, Milpitas, CA 95035 % 408-943-6900 E-mail:
mhall@semi.org Web:
www.semi.org r
again include IPC’s hand solder- ing competition for young profes- sionals as well as the Future Packaging production line pre- sented by Fraunhofer IZM, this year on the topic of “Trust the Line — Competitiveness through Trust, Sustainable Tool and Supply Chain.” The topic of supply chains will
also be addressed at the “EMS Park” special showcase area. Offering impulse and best practice presentations (e.g. from Uhlmann & Zacher on the topic of EMS selection, specification creation and collaboration), this will high- light the benefits of close collabo-
ration between EMS providers and OEMs for both sides and pro- vide a platform for personal exchange that builds trust to dele- gate development issues and opti- mize the supply chain. The “PCB meets Compo -
nents” joint booth enjoys a high level of participation, with Würth Elektronik among the exhibiting companies. With con- tributions on current topics such as “Operating AI use cases inte- grated into electronics manufac- turing lines” (Dr. Sebastian Mehl, Siemens AG) on May 10 and the topics “Promoting young talent” and “Women in mechani-
Page 97 SMTconnect: “Driving manufacturing forward.”
cal engineering — change in the company” on May 11, the trade fair forum promises an exciting program. This year, in addition to the
ZVEI and Fraunhofer IZM, the VDMA and the German Associa - tion for Electronics Design & Manufacturing, FED e.V., are also participating, each with sev- eral program items. Contact: Mesago Messe
Frankfurt GmbH, Rotebühlstrasse 83-85, 70178 Stuttgart, Germany % +49-711-61946-0 E-mail:
info@mesago.com Web:
www.smt.mesago.com r
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