Page 56


www.us-tech.com Potting Optimized Component Design


Continued from page 54 Finally, define additional


functions at an early stage. Sometimes components are com- pletely potted and therefore there is no need for a cover. This simplifies the design and saves weight.


Another benefit is that the


potted components are shielded from view and therefore protect- ed against industrial espionage. Another form of potting is


the sealing of components, for example to protect against envi- ronmental influences and corro- sion. The objectives here are increased service life and func- tional reliability. Sensitive elec- tronic surfaces, such as on a printed circuit board, are coated with a thin layer of resin or pro- tective varnish. In principle, potting sur-


faces can now be designed in such a way that they meet haptic requirements for end products. There is then no need for any housing.


When designing components


and products, however, the ques- tion always arises as to whether such properties are really need- ed, or whether a “cover solution” would not be the better option for repair purposes. In actual practice, there are


cases where poor component design can no longer be changed. All that can then be done is to


Robotic solutions offer maximum flexibility, but are often the most expensive.


Depending on the potting


system, there are various auto - mation options here. They range from positioning solutions such as lifting and tilting units inte- grated in a three-axis system to robot arms. Basically, the pot- ting system needs to do more


appropriate for the component design. First of all, all the parties involved should be aware of the functions that the potting will be performing. Does the component only need to be protected from moisture or mechanical stress? Are heat-conducting properties


adapt the potting process. This means ensuring that the compo- nent is perfectly positioned under the dispensing needle so that the potting compound reaches even the furthest corners of a component without bubbles and that all the air can escape.


work, so cycle times are longer. Material Selection The design and production


teams not only develop the com- ponents they also select the pot- ting material. This must meet the product requirements and be


needed? Is insulation or dielec- tric strength required? These questions are used to


get material suppliers and sys- tem manufacturers on board in order to benefit from their expe- rience and know-how. Because every material behaves different- ly and therefore can be processed differently. This ultimately has an impact on which potting sys- tem is best for the job. There are many proven


materials based on silicone, epoxy or polyurethane that are available for effective protection of components. Silicones, for example, have a surface that is excellent at repelling water. They are electrical insulators, dampen mechanical vibrations and re main unchanged over a wide range of temperatures. Polyurethanes are highly


customizable. Depending on the formulation, they can be very soft or extremely hard after cur- ing. These resins adhere very well to metals and shrink com- paratively little during harden- ing. Their thermal conductivity is very good. Epoxy resin has very good


adhesive properties and excel- lent electrical insulation proper- ties. Thermal resistance under continuous load is as high as +365°F (180°C). Component design has a sig- Continued on page 58


Continued on page xx


April/May 2023


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