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April/May 2023
StratEdge Offers Molded Ceramic Semiconductor Packages
SANTEE, CA — StratEdge Corporation of- fers a range of molded ceramic packages. The molded ceramic packages can be configured to meet the requirements for chips with fre- quencies up to 18 GHz. StratEdge molded ce- ramic packages come in over 200 standard outlines, dramatically increasing customer packaging options. With the molded ceramic package, the
standard ASTM F15 alloy base can be replaced with a thermally conductive copper composite or copper laminate base. Using a molded ce-
Molded ceramic package.
ramic package provides the advantages of her- meticity, a broad array of open-tooled pack- ages, and lower cost. The addition of the ther- mally enhanced base provides the heat dissi- pation needed for high-power devices used in defense and aerospace applications. For applications where the customer re-
quires a surface-mounted component, these packages can be manufactured with gull-wing- formed leads. They offer flexibility because changing the lead design to match an existing footprint is inexpensive. StratEdge also offers complete assembly and test servic- es for these packages, including automated gold-tin solder die at- tach, which is ideal for gallium ni- tride (GaN) and gallium arsenide
(GaAs) devices. Contact: StratEdge Corp.,
9424 Abraham Way, Santee, CA 92071 % 858-569-5000 E-mail:
c.krawiec@
stratedge.com Web:
www.stratedge.com
YINCAE Launches Thermal Underfill
ALBANY, NY — YINCAE, a leading manufacturer of high- performance electronic materi- als, has announced the release of a breakthrough product: Ther- mal Underfill, UF 158A2. Designed for use in a variety
of electronic devices, not only can UF 158A2 replace underfill, sil- ver epoxy paste and thermal pad/paste in one step in CoWoS package, but also provides supe- rior protection and improved thermal management for critical components. Thermal underfill also enhances the structural in- tegrity of the assembly while re- ducing stress on solder joints. UF 158A2 is ideal for use in
high-reliability applications sub- ject to temperature cycling, shock, and vibration, which can cause damage to electronic components. The product features excellent thermal conductivity and high- temperature stability, ensuring optimal performance even in the most demanding environments. UF 158A2 is available in a
variety of formulations to suit dif- ferent application requirements. The product is easy to apply and can be cured at low temperatures, making it suitable for use with a range of electronic devices. With its exceptional performance, relia- bility, and ease of use, UF 158A2 is set to become a key player in the
electronics industry. Contact: YINCAE Advanced Materials, LLC, 19 Walker Way,
Albany, NY 12205 % 518-452-2880 E-mail:
yincae_cs@yincae.com Web:
www.yincae.com
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