April/May 2023
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Page 71
Selective Soldering: Need for Innovation and Development Continued from previous page
When the surface energy of the solid is greater than the surface tension of the liquid, the droplet will spread out more and have a lower contact angle. Figure 2 (a) and (b) are an example of this. Typically, a static system
would be preferred for wettabili- ty studies, but we are dealing with a dynamic process in the case of a nozzle. In this instance, the wetting
of the solder to the tip of the noz- zle maintains a stable radial wave and achieves control dur- ing the soldering process by maintaining a stable dome shape to deposit solder. Figure 3 shows a well wet- ted nozzle wherein the solder is
Viscom Demos Latest Networked
3D AOI DULUTH, GA — At SMTconnect in Nuremberg, Germany, Viscom AG will showcase the successor of the S3088 ultra gold, the iS6059 PCB Inspection Plus. Its new and faster sensor technology, data pro- cessing and analysis functions all stand for the best 3D AOI per- formance that meets the highest requirements in industrial use. The latest AI-supported software applications and technical ad - vance ments in X-ray inspection will also be presented to visitors “hands-on” at the booth. Viscom’s product portfolio is
growing and offers a very wide variety of powerful systems for different production stages and inspection requirements — espe- cially for quality control in mod- ern electronics manufacturing. Automatically monitored opera- tional stability, location-inde- pendent networked condition monitoring, cloud-based solu- tions, the integration of manu- facturer-independent interfaces and targeted use of artificial intelligence are just as much a part of this as ensuring audit- proof repeat accuracies or ever higher resolutions while main- taining low cycle times. AI is also used when measur-
ing voids in solder joints as part of an X-ray inspection and excluding defects due to individual factors. Viscom systems such as the iX7059 PCB Inspection XL shown at SMTconnect detect these and other hidden defect types. Contact: Viscom, Inc., 1775
Breckinridge Parkway, Suite
500, Duluth, GA 30096 % 678-966-9835 E-mail:
info@viscomusa.com Web:
www.viscom.com
See at SMTconnect, Hall A4 Booth 120
www.cedatec.it Figure 2: scenarios with various levels of wetting.
adhered to the entire outer sur- face of the nozzle and therefore has a stable radial wave. This allows for good control during the selective soldering process. The static wettability for this nozzle would be akin to Figure 2 (a) or (b). In the case of a material that
solder does not readily wet to (non-wetting), the surface energy of the nozzle (or other material being wetted) is not enough to overcome the surface energy of the solder and therefore the sol- der will maintain a single stream as shown in Figure 4. The static
Continued on next page
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WORLWIDE PATENTED
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