April/May 2023
www.us -
tech.com
CRANSTON, RI — AIM Solder, a lead- ing global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the release of its newest halogen-free no clean solder paste, H10. H10 offers exceptional fine feature
printing, improved electrochemical relia- bility, and powerful wetting in AIM’s brand-new halogen-free no clean solder paste. H10 solder paste is capable of transfer efficiency greater than 90% on area ratios of 0.50 and a stencil life greater than eight hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all sur- face finishes. H10 reduces voiding on BGA, BTC and LGA and offers
Innoscience: SolidGaN Integrated Half-Bridge
Solution SAN JOSE, CA — Innoscience Technology, the company found- ed to create a global energy ecosystem based on high-per- formance,
low-cost, gallium-
nitride-on-silicon (GaN-on-Si) power solutions, today launched the first in a new family of SolidGaN integrated GaN devices. ISG3201 is a complete half-bridge circuit including two 100V 3.2 mW InnoGaN HEMTs and the required driver circuitry in an LGA package. The ISG3201 SolidGaN half-
bridge comprises two 100V 3.2 mW e-mode GaN HEMTs with driver, driving resistor, boot- strap and Vcc capacitors. It has a 34A continuous current capabili- ty, zero reverse recovery charge and ultra-low on resistance. Thanks to the high level of
integration, gate loop and power loop parasitics are kept below 1nH. As a result, voltage spikes on switching nodes are mini- mized. The Turn-On speed of the half-bridge GaN HEMTs can be adjusted using a single resistor. ISG3201 is suitable for high
frequency Buck converters, half- bridge or full-bridge converters, Class D audio amplifiers, LLC converters and power modules. Overall, the integrated ISG3201 solution can save up to 20% PCB space on discrete GaN designs and 73% board space on tradi-
tional silicon implementations. Contact: Innoscience, 3756
Arlen Court, San Jose, CA 95132 % 408-502-4626 E-mail:
peterrogerson@innoscience.com Web:
www.innoscience.com
www.cyberoptics.com Copyright © Nordson Corporation. All rights reserved. SPI
AIM Launches Halogen-Free No Clean Solder Paste
Page 83
enhanced electrochemical reliability on all low stand-off devices. H10 is zero halogen per EN14562
and halide-free per IPC J-STD-004 cur- rent rev and is compatible with AIM’s full line of no clean flux chemistries. Fit for automotive, LED and aerospace assemblies, H10 no clean solder paste is
Drive, Cranston, RI 02920 % 401-463-5605 Web:
www.aimsolder.com
robust, stable, and easy to implement. Contact: AIM Solder, 25 Kenny
H10 halogen-free solder paste print. See at SMTconnect, Hall 4 Booth 316
Next-gen multi-process inspector with paramount speed, accuracy and resolution.
Think Fast. See Small. NEW
5 Micron Ultra-High Res MRS Sensor
AOI
CMM
NEW SQ3000™ + All-in-One Solution
For improved yields and processes. With all-in-one functionality for AOI, SPI plus CMM applications to attain in-line coordinate measurements much faster than a traditional CMM – in seconds, not hours.
Powered by Multi-Reflection Suppression® (MRS®) sensor technology, the new 5 micron Ultra-High Resolution MRS sensor offers unmatched accuracy by meticulously identifying and rejecting reflection based distortions caused by shiny components and surfaces. The result is ultra-high quality 3D images, high-speed inspection and metrology, and improved yields and processes.
Count on the CyberOptics SQ3000+ for superior performance for next-generation applications including advanced packaging, advanced SMT, mini LED, 008004/0201 solder paste, and other high-end applications.
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