April/May 2023


www.us-tech.com


New Lead-Free Solder Paste from SHENMAO


SAN JOSE, CA — SHENMAO America, Inc. has released its


great flux activity that can pre- vent oxidation of solder powder


Page 35 The material matters in material handling


PF606-P130N solder paste.


new anti-HoP lead-free solder paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pil- low (HoP) issues. The demand for ultra-thin


packages has increased, thus the reduction in package thickness has caused increased warpage. The warpage during the reflow process increases the gap be- tween BGA components and sol- der paste, leading to HoP issues and production yield loss. PF606-P130N features


during the reflow process. Fur- thermore, the new paste shows excellent solderability and hot slump performance to cover the warpage of components and pre- vent BGA/CSP HoP issues. PF606-P130N is designed for the SMT process, especially for


thin BGA package components. Contact: SHENMAO Ameri- ca, Inc., 2156 Ringwood Avenue,


San Jose, CA 95131 % 408-943-1755 fax:408-684-5477 E-mail: usa@shenmao.com Web: www.shenmao.com


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