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July, 2020 KOKI Releases Type 5 Air-Reflowable Solder Paste
Lake Elsinore, CA — KOKI has re- leased a new type 5 solder paste, S3X70-G811, for micro-pattern appli- cations that can be reflowed in air. As further miniaturization and multi- functionalization of electric devices accelerate, the size of the components decreases. As a result, components smaller than 1608 (0603 metric) are being evaluated for adoption more than ever before. Solder pastes used for micro-
pattern applications generally adopt finer-sized solder powder. Such fine powders increase the total surface area to be exposed to oxidation and causes soldering failures, such as non-molten solder and solder balling in air reflow. Should disruptions in the print-
ing process occur, solder paste re- maining at the aperture inner walls will dry out and interfere with prop- er printing through the stencil aper- tures. This is critical, especially for
micro-pattern applications. S3X70-G811 contains a new
flux formulation optimized for type 5 solder powder and enables air reflow soldering of 01005 (0402 metric) com- ponents with some distinct advan- tages. It offers excellent meltability and wettability at the micro pattern in air reflow. It reduces stencil issues with its newly developed lubrication technique, due to its non-volatile sol- vent that can keep itself from dying when the paste is left idle — even after a 60-minute pause. Finally, the paste’s wetting per-
formance on various board surface finishes helps the molten solder to quickly push out flux elements and
reduce the occurrence of voids. Contact: Koki Solder America,
Inc., 18510 Pasadena Avenue, Suite
E, Lake Elsinore, CA 92530 % 951-245-8755 E-mail:
roberto@kokiamerica.com Web:
www.kokiamerica.com
TAKAYA Supplies ACTIA with Dual-Sided Flying Prober
Santa Clara, CA —TAKAYA has sold an APT-1600FD-A advanced flying probe test system for assembled PCBs to ACTIA Electronics, Inc., for its new high-mix production facility in Romulus, Michigan. ACTIA spe- cializes in the design, development and manufacturing of electronics for the automotive, aeronautics, rail, telecommunications, and energy in- dustries. The APT-1600FD-A provides
average head speed increases of up to 50 percent with throughput improve- ments of 30 to 50 percent over exist- ing models, making it the industry’s fastest flying probe test system. The APT-1600FD incorporates a
new 10-flying z-axis design, including four vertical flying probes that provide unequalled access to test points where conventional angled probes fail to con- tact. Its six top-side and four bottom-
side flying probes deliver unprecedent- ed speed and performance.
APT-1600FD-A flying probe test system.
Contact: TEXMAC, Inc., 3370
Montgomery Drive, Santa Clara, CA 95054 % 408-970-9171 E-mail:
rmckenzie@texmacusa.com Web:
www.texmac.com
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