SUSS & GEORGIA TECH FORM BIO-MEDICAL & 3D PACKAGING RESEARCH PROJECT S
USS MicroTec and the Georgia Institute of Technology (Georgia Tech) are collaborating on a joint nanotechnology, bio-medical and semiconductor 3D packaging research project.
As a part of the project, a SUSS
MicroTec Mask Aligner will be added to a cluster of SUSS equipment currently installed in the Institute for Electronics and Nanotechnology (IEN) cleanrooms at Georgia Tech, dedicated to bio- medical device research and fabrication. In early 2015, the company also
joined Georgia Tech's Packaging Research Centre (PRC) where advanced exposure tools, including excimer laser ablation systems, are utilised for via drilling on non- photosensitive materials. "The addition of this new
technology will provide needed functionality for our bio-medical and micro-fluidic research by enhancing our soft lithography capabilities with a wide number of related nanotechnology applications, said Dr. Oliver Brand, Executive Director of IEN.
"Excimer laser ablation provides a
simple solution for imaging on non- photo-sensitive materials without the high cost of conventional photolithography where multiple coating, exposure, developing and etching processes are required", said Professor Rao Tummala, Director of Packaging Research Centre at Georgia Tech. "We are fortunate to have access to advanced exposure tools like excimer laser ablation systems to demonstrate smaller features such as via drilling down to 1µm".
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NEW EFFICIENCY RECORD OF 38.9% FOR CPV MODULE
Soitec has announced a new step in its SmartCell project, which focuses on the field of semiconductor materials to develop a four-junction solar cell. The company’s four-junction
SmartCell has now been successfully integrated in a concentrated photovoltaic (CPV) module, enabling a conversion of 38.9 percent of the solar energy into electrical power. This technology paves the way for further cost reductions in solar energy, as it can be integrated in a record- efficiency CPV module suitable for
mass production. CPV modules use Fresnel lenses to concentrate sunlight onto small, multi-junction solar cells. SmartCells were integrated in a CPV
module employing the same platform as existing CPV modules using traditional three-junction cells. The SmartCells proved to have a superior conversion yield due to their four junctions. The record module efficiency has
been measured indoors and outdoors. More than 10,000 outdoor data sets have been recorded. Fraunhofer ISE performed a detailed analysis and
revealed a module efficiency of 38.9 percent ±0.9 percent for a 1,000 W/m² direct normal irradiation and a 25°C cell temperature. The record module has an aperture area of 812cm2 and uses 36 lenses, secondary optical elements and SmartCells.
As a stand-alone cell prior to being
assembled in a CPV module, the SmartCell previously set a world record efficiency of 46.0 percent, as published on December 1, 2014.
www.soitec.com
A smarter approach to applying advanced thin-film coatings to high value engineering products is being developed by Teer Coatings, Cobham Technical Services and The Open University. The collaborative project, which is co-funded by a £577,000 award from Innovate UK - the UK's Innovation Agency - will develop a groundbreaking practical tool for simulating sputter coating, to deliver a right-first-time process.
www.innovateuk.org
SUCCESS FOR SILICON PHOTONICS PROTOTYPING PARTNERSHIP
T
he Summer issue of Micro Matters brings a special
preview edition for the up and coming Micro | Nano | MEMS 2015 high precision manufacturing exhibition and conference taking place at the NEC in Sept. Exploring some of the show highlights and exciting line-up of speakers presenting the latest ground- breaking developments at the show. In this issue there are also focuses on nanotechnology with the latest in energy harvesting for portable devices from Linear Technology and a look at the cutting edge in micro moulding techniques from Accumold and Ultrasion.
Michelle Winny - Editor 4 SUMMER 2015 | MICROMATTERS
Imec and its partners have successfully completed a three-year program (2012 - 2015) to leverage a variety of silicon photonics technologies by making them accessible for industry and academia worldwide. Within the ESSenTIAL program funded by the European Commission, imec has worked closely with CEA- LETI (France), Tyndall Institute (Ireland), VTT (Finland), IHP (Germany), TNO (The Netherlands) and CMC (Canada) to develop advanced multi-project-wafer services as well as packaging services for silicon photonics. The services were made accessible to industrial players – both small- and medium-sized companies – enabling them to test silicon photonics technology. Silicon photonics is a key enabling
technology for a wide range of markets, from optical interconnect networks in data centers to
disposable biosensor chips for immunoassays. In essence, silicon photonics builds on the technology portfolio and economy of scale of CMOS fabs to manufacture sophisticated photonic integrated circuits with a combination of passive devices – in particular wavelength and polarisation selective devices – and active devices such as optical modulators and detectors. The ESSenTIAL program has
extensively expanded the services of ePIXfab, an alliance of European entities set up in 2006 to support the emergence of a fabless silicon photonics ecosystem. ePIXfab has provided affordable Multi-Project Wafer (MPW) services to fabless R&D teams worldwide developing photonic circuits. European users received some benefits based on EU funding, but the ePIXfab services were provided globally. Another major achievement of the
project was the creation of silicon photonics packaging services at Tyndall Institute.
www.imec.be
Electro Scientific Industries, Inc. has introduced a new low-cost, high- volume-production laser micromachining platform, adaptable to a range of configurations for different applications including cutting, marking, drilling and engraving. The new platform addresses challenges faced by manufacturers in the fast-changing consumer electronics segment where they cope with new materials, new technologies and evolving consumer expectations. Meanwhile, there is relentless pressure to reduce costs, meet quality requirements and achieve high-volume high-yield production. The Jade platform meets all these diverse requirements.
www.esi.com
Cadence Design Systems, Inc. and Applied Materials, Inc. are collaborating on a development program to optimise the chemical- mechanical planarisation (CMP) process through silicon characterisation and modeling for advanced-node designs at 14nanometer (nm) and below. The program allows design teams to predict the impact of CMP on both functional yield and parametric yield, and for manufacturing teams to boost planarisation performance, which is increasingly critical for advanced FinFET architectures.
www.cadence.com / MICROMATTERS "The close cooperation with
universities and research institutions is of great importance for SUSS MicroTec." said Ralph Zoberbier, General Manager Exposure and Laser Processing at SUSS MicroTec. "We are excited to deepen our relationship with the Georgia Institute of Technology, which is a leading industrial research partner for the high potential growth markets of bio-medical and emerging advanced packaging applications". /
www.suss.com
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