PRODUCTS EDITOR’S CHOICE ADVANCED TOOLS FOR POWER-SUPPLY DESIGNERS
These three new advanced tools offer extensive control over complex designs, along with the ease of exporting simulations to computer- aided design (CAD) platforms from Altium and Cadence Design Systems Inc. New advanced options
include a set of easy-to- use controls to specify
T
exas Instruments (TI) has unveiled a series of advanced
tools as part of its Webench Power Designer, offering extensive design control, analysis and trouble- shooting capability to create complex power-supply designs.
complex design requirements, such as manufacturability, component constraints and design control. The new Compensation Designer tool predicts and automatically corrects errors in the control loop resulting in a stable power-supply
design. This quick “fix-it” feature is a valuable tool for novices or time-pressed engineers. It also offers advanced power experts a manual mode to tune the control loop for more bandwidth and stability in their designs. The new Webench Simulation Export tool moves the power- supply schematic into the user’s preferred simulation environment. With just a couple of clicks and no intermediary software, the Power Designer quickly exports the complete design to the TINA-TI simulator or Altium Designer and Cadence OrCAD and PSpice tools. Texas Instruments
www.ti.com
BLIND RIVET NUTS MOSFETS DELIVER HIGH ENERGY EFFICIENCY FOR E-BIKES
A new family of StrongIRFET MOSFETs has been launched by Infineon Technologies for DC powered circuits including battery powered circuits, brushed and brushless DC (BDLC) motor drives. The MOSFETs can bring high energy efficiency to end-applications such as power and gardening tools, light electric vehicles, drones and e-bikes that demand a high level of energy efficiency but are restricted in available space. This is enabled by the compact Medium Can DirectFET housing featuring a new layout. “The reliability and performance of DirectFET packaging technology is further enhanced with a new
layout that now offers even lower thermal resistance. Combined with rugged silicon, these new StrongIRFET DirectFET MOSFETs offer improvements in overall system-level size, efficiency and cost, making them well suited to all space constrained applications that require that extra efficiency demanded by the manufacturer and the end-user,” said Stephane Ernoux, Product Marketing, Power Management and Multimarket Division, Infineon Technologies. The new StrongIRFET devices are housed in a Medium Can DirectFET package that features dual-sided
cooling to deliver high power density and excellent thermal performance. By re-locating the gate pad to the corner of the die on these latest devices, the new layout significantly increases the source contact area to achieve even lower thermal resistance to the PCB than standard DirectFETpackages, further improving efficiency, and increasing the scalability of design. The new devices, which range from 40V to 75V, feature the characteristics of the company’s
StrongIRFET family, including low on-state resistance (R DS(on)) to minimise conduction losses, high current carrying capability and rugged silicon to improve system reliability. The product family features an environmentally-friendly 100 percent lead-free package that is current and future ROHS compliant. Infineon Technologies
www.infineon.com
TR Fastenings has released its latest Blind Rivet Nuts. These mechanical fasteners ensure a strong thread in a thin sheet and provide a versatile solution where there is little or no access at the rear. Available in many variations and sizes, TR’s huge stock allows delivery mostly within 24 hours. Blind Rivet Nuts – also known as Gripserts, Coleserts and Blind Nuts - can be easily installed into sheet metal as well as tubing and extrusions in steel, stainless steel, aluminium and a variety of plastics. They are available in body styles of round, knurled and hexagonal with head styles of Flange, Countersunk and Reduced in aluminium, steel and stainless steel in sizes M3 to M10 with grip ranges of 0.5 to 6mm.
www.trfastenings.com
America II Electronics, Inc. has signed franchise distribution agreements with eight manufacturers. The company added Kontech USA, EMS Technologies, Power-Sonic Corporation, Global Circuit Innovations, Iskra, Toplite, Pastomold and Quectel Wireless Solutions Co. to its global line card. These latest additions are a result of the company’s supply chain development efforts. “We’re listening to our customers and adding the manufacturers, components and technologies they demand,” said Brian Ellison, president at America II.
www.americaii.com
NEW EUROPEAN OPTICAL AND WIRELESS INNOVATION LAB
Tektronix and IRCICA, a major French research laboratory are to open a new optical and wireless communications innovation laboratory at the University of Lille in France. Fully outfitted with the latest Tektronix high-speed test solutions, the new laboratory will focus on coherent optical and THz wireless transceiver technology research while also making its facilities available to
external companies working to develop high- speed optical and wireless technologies. The new facility will be called The Tektronix European Optical and Wireless Innovation Laboratory. Fueled by the demand for ever-faster data
transmission capacity around the world, the new lab will explore such technologies as spatial division multiplexing and multicore fibres in an effort to drive optical data transmission rates beyond the petabyte per second range (PB/s) – significantly faster than what’s possible currently. To support such advanced research, the lab
will be outfitted with the most capable coherent optical test solutions available in the industry. End-to-end transmit and receive test solutions
8 JULY/AUGUST 2015 | ELECTRONICS
in the lab will include a Tektronix AWG70001A 50Gs/S waveform generator, OM5110 46 Gbaud multi-format complex optical transmitter and Tektronix DPO77002SX ATI 70GHz real time oscilloscopes.
“Pushing data rates over PB/s is a major
challenge that requires the best of the best,” said Nathalie Rolland, IRCICA Director. “For this new lab, IRCICA brings its expertise in modeling, optical characterisation and state-of-the-art active and passive fibres manufacturing while Tektronix brings its industry leading next generation test equipment that will enable us to quantify signal quality in terms of BER, EVM and eye diagrams.” Tektronix
www.tektronix.com
/ ELECTRONICS
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