MICRO | NANO | MEMS 2015 SHOW PREVIEW
Made to measure: High precision engineering exhibition and conference
European event for product development and additive manufacturing technologies
• PPMA Show - Processing & Packaging Machinery
Micro | Nano | MEMS 2015 is the UK’s number one showcase for high precision engineering and microfabrication techniques for MEMS, nanotechnologies and micro scale devices. Once again the show returns to the NEC from 30th Sept – 1st Oct, offering a vibrant exhibition full of key industry players and comprehensive technical conference programme, that is all free to attend
M
icro | Nano | MEMS 2015 exhibition and conference will present the state of
the art in micro manufacturing, exploring the latest in micro tooling and microfabrication techniques for very small electronic designs and components right down to the micrometre-scale and smaller. Approaching its 7th annual edition, from September 30th - October 1st 2015, Hall 3, at the National Exhibition Centre (NEC) Birmingham, UK, once again, this year’s event is supported by a strong seminar programme that will explore the latest processes and equipment for manufacturing on the micro scale.
MEMS & NANO TECHNOLOGY MANUFACTURING PARTNERSHIPS Bolstering new and existing long-standing relationships for 2015, the show will be working in association with key industry organisations including JEMI, NanoKTN, MANCEF and Institute of Nanotechnology to create a compelling array of presentations in this ground breaking field. To add to the mix exhibitors will be featuring live machine demonstrations for a hands-on approach to the latest machinery and equipment.
/ ELECTRONICS
MULTI SHOW ENTRY Micro | Nano | MEMS 2015 is co-located with four other leading industrial events allowing visitors multi access to all these shows with the same ticket: • Sensors & Instrumentation - The UK’s only dedicated sensing technology event
• The Machine Building Show - The UK’s annual automation showcase
• TCT Show + Personalise - The leading
TECHNICAL SHOW CONFERENCE The Micro | Nano | MEMS 2015 conference features a line-up of exciting presentations delivering the latest in groundbreaking manufacturing techniques and innovations. Aaron Johnson, Vice President of Marketing & Customer Strategy and a part of the technical sales team at Accumold will present a paper on the latest micro moulding technologies. Johnson, is recognised as a leader in the subject of micro moulding and has been with Accumold since 2005. There are a number of commercial drivers in the microelectronics and display industries including the requirement for better, faster and cheaper devices. Here a discussion will focus on the outstanding potential associated with nanoimprint lithography (NIL) and how this technology can influence cost, production throughput and functional output and will be presented by Dr Mike Cooke who holds a senior position as Experimental Officer at Durham University. Dr Cooke is responsible for the School of Engineering’s MEMS cleanroom facility and equipment, as well as undertaking his own research looking at developing new processes for micro and nanoscale devices. Nanoimprint technology is well advanced,
Figure 1:
Microscopic view of nanoscale spherical structures
in both process and equipment development, which can be used to fabricate sub-micron features. Discussion will be made of the different types of nanoimprint lithography (both UV and thermal), and the pros and cons of using each.
GRAPHENE A presentation on turning surfaces into multi-point, real-time pressure sensors by using grapheme will be given by Sector Manager of Electronic Inks at Haydale, Rob Haslett. This technology is the first to be commercialised under a pipeline collaboration agreement between Haydale and the Welsh Centre for Printing and Coating (WCPC). Haydale’s proprietary HDPlas process
allows graphene to be efficiently combined with a range of host materials to improve properties such as strength and conductivity while WCPC has in-depth expertise in developing and applying inks and coatings. A paper on enabling technology for
manufacturing of 3D semiconductor components will be presented by Ian Burnett
ELECTRONICS | JULY/AUGUST 2015 21
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