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SMTAI Keynoters and Live Process Printing and Inspection
Minneapolis, MN — SMTA has an excellent line-up of keynote speakers for the 2015 SMTA International technical conference this September 27 to October 1, 2015 at the Donald Stephens Convention Center in Rosemont, Illinois. The Opening Session at SMTA
International on September 29, 2015, will feature Rozalia Beica, CTO at Yole Developpement, as the keynote speaker. She will present “3D Technology
Trends and
Manufacturing Challenges.” This is a free event at SMTA International and includes breakfast treats and coffee for all attendees. The presen- tation will provide an overview of the packaging technologies, highlighting
the miniaturization trends and future roadmaps. Impact of new packaging technologies on assembly needs and rework, highlighting new advancements in materials and equipment as well as assembly and manufacturing processes needed to address these challenges will be pre- sented. Murad Kurwa, Vice President of
Engineering at Flextronics Inter - national, will present “Wearables Technology — The Next Manufac - turing Wave” to the attendees of the Evolving Technologies Summit on Monday, September 28 during SMTA International. A new wave of wear- ables brings with it plenty of manu- facturing and process development
IMAPS to Be in Orlando
Research Triangle Park, NC — The 48th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). It will be held October 26- 29 at the Rosen Centre Hotel in Orlando, Florida. The IMAPS 2015 Technical
Committee is putting together a pro- gram of original papers that present progress on technologies throughout the entire microelectronics/packag- ing supply chain. The Symposium will have 5 technical tracks that span the three
days of sessions on: Packaging the Internet of Things: Leading the Race from Technology to System; Inter - posers & 2.5/3D Packaging; Ad - vanced Packaging and Enabling Technologies; Advanced Materials & Processes; Modeling, Design, Test & Reliability; as well as the Interactive University Poster Session. Technical sessions are being planned for these tracks. Contact: IMAPS, PO Box
110127, Research Triangle Park, NC 27709-5127 % 919-293-5000 fax: 919-287-2339 Web:
www.imaps.org/imaps2015
2015 EDITOrIAL CALENDAr ISSUE Jan/Feb March April/May EDITORIAL
Assembly & Packaging ATX West/MDM PP APEX PP
Test & Measurement
SMT & Production Nepcon China PP SMT/Hybrid/PKG PP EDS PP
June July August
Components & Distribution Atlantic Design PP Test & Assembly
Semicon West/Intersolar PP
Production & Packaging Nepcon South China PP
September PCB & Test SMTAI PP PCB West PP ATX Phila PP
October
SMT & Asswmbly Productronica PP MDM Minneapolis PP
Nepcon South China
WESTEC PCB West SMTAI ATX Philadelphia
IMAPS
The Assembly SOUT-TEC Autotest
MDM Minneapolis FABTEC Productronica
Nov/Dec
Components & Distribution ATX West/MDM PP
PP= Product Preview ATX West/MDM PP 8/25 - 8/27
9/15 - 9/17 9/22 - 9/24 9/28 - 10/1 /
10/27 - 10/29 10/27 - 10/29 10/27 - 10/29 11/2 - 11/5 11/4 - 11/5 11/10 - 11/12 11/10 - 11/13 2/12 - 2/14
Shenzhen, China
Los Angeles, CA Santa Clara, CA Rosemont, IL
Orlando, FL Rosemont, IL Charlotte, NC Washington, DC Minneapolis, MN Chicago, IL
Munich, Germany Anaheim, CA
SHOW DesignCon
ATX West/MDM APEX APEC
Nepcon China SMT/Hybrid/PKG
Electronics New England EDS
EASTEC
Wire Processing Tech Atlantic Design/MDM
Semicon West/Intersolar DATE
1/27 - 1/29 2/10 - 2/12 2/24 - 2/26 3/17 - 3/19
4/21 - 4/23 5/5 - 5/7 5/6 - 5/7 5/12 - 5/14 5/12 - 5/14 5/13 - 5/14
6/9 - 6/11 7/14 - 7/16 LOCATION
Santa Clara, CA Anaheim, CA San Diego, CA Charlotte, NC
Shanghai, China Nuremberg, Germany Boston, MA Las Vegas, NV Milwaukee, WI
New York, NY San Francisco, CA
concerns. Kurwa will discuss sub- strate advances like stretchable con- ductive fabrics, interconnects, new sensor technology including printed sensors (ECG) and OLED, assembly concerns for flexible conductive adhe- sive and nano-sintering, and encap- sulation techniques such as low pres- sure molding and water proof coat- ing. New equipment like R2R print- ing and assembly, fabric laser cut- ting, and ultrasonic welding on fabric will be discussed. The presentation will also address how reliability test- ing has adapted with flexibility test- ing, washability, salt spray, and sweat testing. Reza Ghaffarian Ph.D., Jet Propulsion Laboratory, will chair the session.
For the concurrent Harsh
Environment Symposium Keynote Lunch, Jim Springer, Vice President of Quality at John Deere Electronic Solutions, will present “Extreme Environment Electronics — Where We’ve Been, Where We Are Going and What Could Be Next.” Jim will provide a genesis and the evolution of electronics designed for use in harsh physical and electrical envi- ronments, particularly those used in farming and automotive industries. Examples of ruggedization protocols will be discussed. Pradeep Lall, Ph.D., Auburn University, will chair the session. Conference registration is required to attend the Evolving
Continued on next page
Trade Show Calendar MORE SHOWS:
www.topline.tv/tradeshows.cfm
July 14-16, SEMICON West.*Moscone Center, San Francisco, CA. Contact: SEMI, 3081 Zanker Road, San Jose, CA 95134 % 408-943-7988 Web:
www.semi.org or
www.semiconwest.org
Aug. 25-27, Nepcon South China.*Shenzhen Convention & Exhibition Center, Shenzhen, China. Contact: Reed Exhibitions China, 1-3 Xinyuan South Road, Chaoyang
District, Beijing, Ping An International Finance Center A, Floor 15, China 100027 % +86-10-5933 9346 fax: +86-10-5933 9333 E-mail:
inquiry@reedexpo.com.cn Web:
www.reedexpo.com.cn or
www.nepconsouthchina.com
Sep. 9-11, International Drone Conference and Exposition.*The Rio, Las Vegas, NV.
Contact: BZ Media LLC, 225 BroadHollow Road, Ste. 211E, Melville, NY 11747 % 631-421-4158 Web:
www.interdrone.com
Sep. 15, IEEE SA/ICAP Symposium on Conformity Assessment.*St. Louis Convention Center, St. Louis, MO. Web:
http://standards.ieee.org/about/icap/about.html
Sep. 15-18, IEEE AUTOTEST (formerly Autotestcon). *America Center Convention Complex, St. Louis, MO. Info:
www.ieee-autotest.com
Sep. 27-Oct 1, SMTA International*Donald E. Stephens Convention Ctr., Rosemont, IL. Web:
www.smta.org/smtai
Oct. 13-15, International Wafer-Level Packaging Conference (IWLPC).*DoubleTree Hotel, San Jose, CA. Contact: SMTA, 5200 Willson Rd., Suite 215, Edina, MN 55424 952-920- 7682 fax: 952-926-1819 Web:
www.smta.org or
www.iwlpc.com
Oct. 27-29, IMAPS 2015. *Rosen Centre Hotel, Orlando, Florida. Contact: IMAPS, PO Box 110127, Research Triangle Park, NC 27709-5127 % 919-293-5000 fax: 919-287-2339 Web:
www.imaps.org/imaps2015
Oct. 27-29, The Assembly Show.*Donald E. Stephens Convention Center, Rosemont, IL. Contact:
www.theassemblyshow.com
Nov. 2-5, IEEE AUTOTEST. *Gaylord National Resort & Convention Center, National Harbor, MD. Info:
www.autotestcon.com or Conference Catalysts, 802 NW 16th Ave., Ste. B, Gainesville, FL 32601 % 352-872-5544 E-mail:
cdyer@conferencecatalysts.com Web:
www.conferencecatalysts.com
Nov. 4-5, Midwest Design-2-Part Show. *Northern Kentucky Convention Center, Covington, KY. Contact: Design-2-Part Shows, P.O. Box 7193, Prospect, CT 06712 % 203- 758- 6663 Web:
www.d2p.com
Nov. 10-13, productronica.*New Munich Trade Fair Centre, Munich, Germany. Contact: Munich Trade Fairs, 75 Broad St., 21 Floor, New York, NY 10004 % 646-437-1014 Web:
www.munichtradefairs.com or
www.productronica.com
Nov. 18-19, MD&M Florida.*Orange County Convention center, Orlando, FL. Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.ubmcanon.com
Dec. 2-4, International Printed Circuit and APEX South China Fair.*Shenzhen Convention and Exhibition center, Shenzhen, China. Contact: IPC % 877-472-4724 or 847-597-2860 (outside U.S. & Canada) Web:
ipc.org or
www.hkpca-ipc-show.org
Jan. 6-9, 2016, International CES. *Las Vegas Convention Center and other convention spaces, Las Vegas, NV. Contact: Consumer Electronics Association, 1919 S. Eads St., Arlington, VA 22202 % 866-233-7968 Web:
www.CE.org or
www.cesweb.org
July, 2015
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