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Sandia Making LEP Base Wafers


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I’m very, very proud of the team,” said Gil Herrera, Director of Mi- crosystems Science & Technology. “Now the hard part begins: We’ve got to make the parts.”


Microsystems Work MESA is the center of San-


dia’s investment in microsystems research, development and proto- typing. The 400,000-square foot complex of cleanrooms, labs and offices is home to design, develop- ment, manufacture, integration and qualification of trusted mi- crosystems for national security applications. MESA includes the Silicon


Fab, completed in 1988, and the Compound Semiconductor Micro- Fab, completed in 2006. The Sili- con Fab, certified by the Depart- ment of Defense as a trusted foundry, develops and produces technologies for radiation-hard- ened complementary metal-ox- ide-semiconductor integrated cir- cuits and micro-electro-mechani- cal systems. The MicroFab is a green-certified plant for III-V compound semiconductor materi- al processing, post-silicon wafer processing and advanced packaging and for heterojunction bipolar tran- sistor production. Both fabs conduct research and development for future nuclear weapon and national securi- ty applications. Kaila Raby, manager for the


Ten different ASIC products go


into the three weapon systems, Raby said. Seven of the 10 ASICs have base wafers that are customized into product-specific designs during later production, she said. It’s these base wafers the Silicon Fab started manu- facturing.


July, 2015


Dana Pulliam enters information be- fore running an operation in Sandia National Laboratories’ MESA com-


plex. The fab has begun making sili- con wafers for three nuclear weapon programs in the largest production series in MESA’s history.


Sandia has invested in new man-


ASICs Product Realization Team, said starting production was a huge milestone. The Silicon Fab will make ASICs through 2018 on the plant’s normal schedule of 24 hours a day, five days a week. In addition, the Mi- croFab is preparing to make hetero- junction bipolar transistor integrated circuits in April, the first time MESA will produce those products for the stockpile, Raby said.


ufacturing tools and processes for MESA, including 2-D marking, simi- lar to bar-coding, for individual de- vices; an electronic production control system; automated lot acceptance sup- port systems; streamlined quality management; and a greater focus on preventing defects, Herrera said. “A lot of things we’ve been work-


ing on for the last few years came to- gether, and we’re doing all this while minimizing impacts to our other work for national security customers and the research mission,” he said. MESA Silicon Fab finished wafer fabrication for the W76-1 nu-


Continued on page 8 Contents


Tech-Op-Ed ........................... 4 Tech Watch ........................... 10 Supply Chain ........................... 12 People.................................... 14 Business News......................... 16 Business Briefs........................ 17 Management........................ 18 EMS .................................... 20 ElectronicMfg. Prods............. 24 Production.......................... 42 Partnering........................... 44 Distribution........................ 46 New Products....................... 74 High-Tech Events................... 84 Editorial Calendar............... 84 Advertisers Index................... 86


Special Focus: Test and Assembly.................. 52


Product Preview: SEMICON West ....................... 62


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