July, 2015
www.us-
tech.com
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MIRTEC Previews Advanced SiP Inspection and Measurement System
Oxford, CT—MIRTEC is showing its most recent solutions for System in Package (SiP) inspection and meas- urement. The company’s MP-520 sys- tem was developed specifically to address the challenges related to SiP inspection. It combines Precision Linear Drive Motor Technology with the company’s exclusive 25Mega - Pixel CoaXPress Camera System, a 3D Confocal Measurement system and special OMNI-VISION 3D Digital Multi-Frequency Moire Tech - nology to provide high-speed, high- resolution inspection and measure- ment for SiP and other semiconduc- tor applications. The MP-520 also is configured
with eight (8) phase color lighting and four (4) 10MegaPixel side-view cam- eras. The MP-520 is suitable for meas- urement and inspection of these man- ufacturing criteria: solder ball/ bump — presence, pitch, offset, height, co- planarity and bridging; bond wire — short, broken, shift and loop height; chip bond — offset, height, crack and
Henkel: New Temperature Stable Solder
Paste Irvine, CA— The Electronics Group of Henkel has launched the first-ever temperature stable solder paste mate- rial. The game-changing formulation, LOCTITE GC 10, is temperature sta- ble at 26.5°C for one year and stable at temperatures of up to 40°C for one month, which affords exceptional per- formance throughout the logistics and operations chain — from shipping/ receiving to printing and reflow. According to the company, this
is the most exciting thing that’s hap- pened in solder materials develop- ment in decades. A material that has temperature stability from shipping all the way through to final assembly is a remarkable achievement. In process, LOCTITE GC 10
offers significant improvements over conventional solder paste materials. As compared to traditional materials which average abandon times ranging from 1 to 4 hours, the halogen-free, lead-free, temperature-stable Henkel formula enables abandon times of up to 24 hours and has a startup time of zero. Stabilized and consistent print transfer efficiency, an expanded reflow window and increased activity for better results with soak tempera- tures be tween 150°C and 200°C, make the new material incomparable among other paste materials. The sol- der system’s stability on the line allows for significant cost savings with on- line paste utilization of more than 95 percent. The reductions in solder-related defects achieved with the new material’s process perform- ance result in higher yields and
improved profitability. Contact: Henkel Corp., 14000
Jamboree Rd., Irvine, CA 92606 % 714- 368-8000 fax: 714-368-2265
Web:
www.henkel.com/electronics or
www.henkelna.com
See at Semicon West Booth #5958.
See at SEMICON West Booth 710
chip; discrete device — presence, off- set, height, co- planarity and solder fillet; heat sink— presence, offset and height; under-fill — presence, fillet and height; PCB — scratch, contami- nation and bridging; package — warpage, crack, mark ing, dimensions and chipping. Inspection and measurement
results are stored in a central data- base, enabling customers to remotely access SPC data through MIRTEC’s INTELLISYS total quality manage- ment system software. This software suite promotes continuous process
improvement by allowing manufac- turers to track and eliminate defects on inspected assemblies. INTEL- LISYS also provides remote debug- ging and monitoring of up to eight production lines, allowing customers to further maximize the efficiency of
the inspection process. Contact: Mirtec Corp., 3 Morse
Rd., #2A, Oxford, CT 06478 % 203-881-5559 fax: 203-881-3322
Web:
www.mirtecusa.com or
www.mirtec.com
Advanced SiP inspection and measurement system.
See at Semicon West Booth #2343.
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