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POWER ELECTRONICS


From a performance perspective, GaN and SiC are superior to silicon But high prices are holding them back from displacing the incumbent. How can this be addressed?


KEYNOTE ANALYST SPEAKER SPEAKER SPEAKER SPEAKER SPEAKER


Ditching the package to drive down GaN transistor costs Alex Lidow - CEO and Co-founder - Efficient Power Conversion (EPC)


When can WBG power electronics truly take off? Remaining technical and economic barriers to overcome


Philippe Roussel - Business Unit Manager - Yole Développement


SiC technology in power electronics – a step change in value Markus Behet - Global Market Segment Manager - Dow Corning Corporation


High performance GaN-on-Si power epiwafers employing rare earth oxide buffer layers David Williams - VP of Business Development - Translucent


Presentation TBC Chris Horton - Director, Global Sales & Marketing - Cree Materials Business


Presentation TBC TBC - KLA-Tencor


Developments in PVD technology for power electronics enabling roadmaps in compound semiconductor devices Reinhard Benz - VP Sales and Marketing - Evatec


Translucent www.translucentinc.com


FRONT-END MOBILES


What’s the biggest threat to revenues for GaAs power amplifiers? Is it the emergence of multi-band, multi-mode PAs built with this material, or the emergence of CMOS solutions?


KEYNOTE ANALYST SPEAKER SPEAKER


The path to intelligent integration Jim Cable - CEO, President and Chairman - Peregrine Semiconductor


Multi-mode, multi-band PAs: friend or foe to the compound semiconductor industry? Eric Higham - Director - Advanced Semiconductor Applications - Strategy Analytics


Improving system level integration and overall efficiency Peter Gammel - Corporate CTO - Skyworks Inc.


LTE is driving complexity in smartphone design Sean Riley - Vice President of Mobile Products - TriQuint


Connecting, informing and inspiring the compound semiconductor industry


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