Cover Story Vender View
Right: HE_2313 The power supply generating the plasma is a key component of plasma based processes
output of 600 watts. For short-term total reflections of output (short circuit with up to 3 kilowatts of reflected output), the internal components are sufficiently shielded to ensure no damage occurs and that the power supply is operating at the highest plasma stability. CombineLine ensures the defined output is accurately delivered by means of a very broad impedance range.
The results are stable processes for all output ranges. Deposition and etching processes are supplied with precise processing energy required which allows less energy to be used while achieving reproducible results and a higher yield.
The TruPlasma RF 1003 has new power combiner technology, called CombineLine, that allows extreme stability for processes.
CombineLine delivers a 50-Ohm output impedance from the power supply, enabling CombineLine to adjust the process optimally at any time. Adjustment networks keep the process constant at an impedance of 50 Ohm. When ideally adjusted, the optimum HF output is introduced into the process.
However, in actual plasma processes, fluctuations always occur that change plasma impedance. The connected matchboxes can react during a limited error adjustment time and re-establish the 50-Ohm state in a matter of seconds. During the error adjustment phases, reflected outputs flow back to the power supply, calling for a quick, precise surge in the power output to hold the energy input steady for the plasma. The reflected output needs to be absorbed into the power supply without damaging it.
This can be done as the combiner technology has a dedicated absorber that can continuously deflect an
TruPlasma RF 1003
An additional benefit of the TruPlasma RF 1003 is an efficiency factor level of more than 80 percent. Due to this efficient energy conversion, the generator is able to reduce energy costs for the user. The source of this high energy conversion level is a special design for internal HF switching phases.
The D converter class employs an optimally adjusted conversion principle produced by interconnecting the high-performance MOSFETs and a low-loss output network. The power supply therefore makes a major contribution to energy efficiency, protecting the environment as well as the customer’s bottom line.
With its compact housing in a half 19” design (216 mm x 133 mm x 381 mm), the TruPlasma RF 1003 is ideal for system integration in plasma deposition tools. The CombineLine technology provides a choice of cable length for connecting the matchbox and processing chamber that makes integration unbelievably easy and sets new benchmarks for efficiency.
HIPIMS generators for efficient and high-level trench-filling Trench-filling with the help of HIPIMS processes is a cutting-edge process in semiconductor manufacturing. As semiconductors become smaller and smaller, the depth- width ratio of the film layers applied to the wafer changes. This change is making it increasingly difficult to fill the trenches. The use of HIPIMS processes makes it much easier to do this.
The essential difference between DC and HIPIMS plasmas is the percentage of ions in the sputtered material. While no ionization occurs in DC plasma, HIPIMS plasma has an ionization rate of up to 90 percent – the result of highly energetic pulses in the megawatt range from the HIPIMS power supply. Ionized particles lead to other mechanisms in growing layers. Moreover, an ionized particle stream with a calculated bias voltage travels directly to the substrate. This is how high filling
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www.compoundsemiconductor.net July 2010
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