search.noResults

search.searching

dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
Page 94


www.us-tech.com


Test for gross and fine leaks in as little as 6 minutes.*


September, 2018


STI Sponsors SMTA International Keynote


Madison, AL — STI Electronics is sponsoring both the keynote address and the fiesta party buffet at SMTA International 2018. An IPC-author- ized training center for J-STD-001, IPC-A-610, IPC/WHMA-A-620, IPC- A-600, and IPC-7711/7721, STI pro- vides both Certified IPC Application Specialist (CIS) and Certified IPC Trainer (CIT) courses. STI’s training serv-


Only NorCom optical leak technology detects both gross and fine leaks in hermetically sealed packages, this fast. Instead of using multiple technologies


and processes, you can leak test virtually any type of package with one high-speed system. The NorCom 2020™


series inspects hermetically sealed components to


MIL-STD 883 requirements either in seam seal trays, or when already mounted to circuits boards and assemblies. It automatically rejects failed devices, and reports the leak rate for each part, eliminating “divide and conquer”leak testing.


NorCom 2020™


Try it free. Send us your package samples today, for a leak test evaluation and report at no charge. *Note: Test time is dependent on package volume


www.norcomsystemsinc.com


610-592-0167 1055West Germantown Pike Norristown, PA 19403 USA


See at IMAPS, Booth 808


ices department devel- ops custom ized training cour ses to fit specific training needs. Typic - ally, STI builds these classes around company- specific standards and specifications. Other courses in -


clude basic soldering, wave soldering, ESD training, BGA rework, and many others. The company pro- vides operator and inspector training for through-hole and SMT soldering, conformal coating, and training to the requirements of NASA-STD- 8739.1 and NASA-STD-8739.4 for Marshall Space Flight Center and its support contractors. In addition to its standardized


training program support materials, STI Electronics’ training materials division provides unique or custom training materials that include fine- pitch, lead-free solder training kits. STI is an approved distributor for IPC training materials. From product design and manu- facturability analysis to pre-produc-


STI offers a variety of electronics training services.


assembly. STI’s engineering services division provides engineering sup- port and specialized contract manu- facturing services for the electronics manufacturing industry. The microelectronics lab spe-


cializes in state-of-the-art engineer- ing design, including current tech- nologies such as chip-on-board (COB) and multi-chip module (MCM), as well as emerging technologies, such as embedded component and die


technology. Contact: STI Electronics, Inc.,


261 Palmer Road, Madison, AL 35758 % 256-461-9191 fax: 256-461- 9566 E-mail: draby@stiusa.com Web: www.stiusa.com


ONLINE AUCTION Complete Closure of 150,000 ft. sq. CNC Maching and SMT Facility Bid: November 6th - 7th


Inspection / Preview: Nov 6th, 9-4 Location: Jamestown, NY


2007 Ekra X4 Screen Printer 2007 Accuflex Screen Printer (3) Quad QSP-2


(2) Siemens S20 SiPlace 80


2000 Siemens SiPlace 80 FS w/ Loader 2001 Siemens SiPlace 80 FS Heller 1800W Oven


2005 Rehm Compact 2 Nitro 1.8 B Yestech YTY-B2 Desktop AOI


Nordson Asymetek Dispense-Mate D-585 (3) Asys PS30 Buffers/Tray Loaders


Systronics Stencil Cleaner Sys 152/2 Quad Feeders, Carts and Accessories


Over 750 Lots!


TheBranfordGroup.com (203) 488-7020


Siemens Feeders, Carts and Accessories Simplimatic Conveyors (2) Schleuniger CS9100 20+ Mantis & Leica Scopes Complete CNC Machining Dept & Much More


tion prototype and development, STI’s prototype and development lab is a full-service design review and preproduction facility. The compa- ny’s microelectronics lab was estab- lished to meet the rising need for advanced systems development and


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108  |  Page 109  |  Page 110  |  Page 111  |  Page 112  |  Page 113  |  Page 114  |  Page 115  |  Page 116  |  Page 117  |  Page 118  |  Page 119  |  Page 120  |  Page 121  |  Page 122  |  Page 123  |  Page 124