September, 2018


www.us-tech.com


Henkel Formulates Breakthrough Die Attach Paste


Irvine, CA — Henkel has developed and commer- cialized a new series of die attach materials to facilitate package-level sintering, addressing the regulatory challenges of high-lead solders, the thermal conductivity drawbacks of conventional die attach pastes, and the processability shortcom- ings of traditional sintering products. The patent-pending LOCTITE® ABLESTIK®


ABP 8068T portfolio includes high-thermal, semi-sin- tering die attach pastes that offer simple processing and excellent thermal and electrical performance, along with reliability, for high power density devices. These new die attach pastes provide a lead-


free alternative for die attach applications in high power density semiconductor packages. LOCTITE ABLESTIK ABP 8068T materials can be implemented using standard processes, without the need for high pressure and temperature, as is the case with conventional silver sinter- ing materials. The die attach pastes form an interpenetrating network of sintered silver and resin. They estab- lish excellent contact with the inter- face for void-free bond lines to achieve outstanding thermal conduc- tivity, resulting in high thermal cycling performance.


Cogiscan Unveils New Smart Factory Software


Bromont, Quebec, Canada — Cogi - scan is unveiling significant develop- ments and changes to its Co-NECT connectivity platform and Factory Intelligence software at SMTA International 2018. Cogiscan’s Co-NECT is de signed


to support all existing and future industry standards, such as SECS/GEM, CAMX, ZVEI, and CFX, as well as proprietary interfaces from leading software and machines ven- dors. Co-NECT is a standalone and neutral connectivity solution that con- nects different machines, software and enterprise systems, enabling Industry 4.0 for electronics assembly. The company’s new Factory


Intelligence — Analytics package offers a series of capabilities to analyze metrics and KPIs over a period of time. The ability to collect and analyze key metrics, such as mach ine OEE, is key to enabling manufacturing staff to quickly identify any deviation from expected performance and drill down to root causes for corrective action. Factory Intelligence runs on the


standard Cogiscan platform, which makes it a simple upgrade for cur- rent Cogiscan customers. With a large library of machine interfaces, the company can deliver a complete solution, including connectivity mid- dleware, material control, traceabili-


ty and analytics capabilities. Contact: Cogiscan, Inc., 28-B


boulevard de l’Aeroport, Bromont,


Quebec, Canada J2L 2N8 % 450-534-2644 E-mail: info@cogiscan.com Web: www.cogiscan.com


See at SMTAI, Booth 1218 See at SMTAI, Booth 623 KYZEN. COM


KYZEN goes way beyond just getting the CLEANING SCIENCE right. We care enough to get to know you and understand your specific needs in order to create the most effective CLEANING TECHNOLOGIES for your process. When you need expert answers for your cleaning challenges, call KYZEN . When science and care converge, it makes all the difference.


Enjoy a free Q&A with the industry’s top cleaning experts. W


WORLDWIDE ENVNVIRO D ONMENTAL NTALLY RESPRESPONSIBLE CLEANING TECHNOLOGI S EC Visit KYZEN in Booth #623 at SMTA International 2018. GIE ABLESTIK ABP 8068T die attach paste. The materials are a drop-in replacement for


standard die attach applications, can be cured in nitrogen or air, and adhere to a variety of surfaces, including silver, copper, nickel-palladium-gold,


and gold. Other attributes of LOCTITE ABLESTIK ABP


8068T series include applicability on a range of die sizes up to 0.2 x 0.2 in. (5 x 5 mm), excellent thermal performance with bulk thermal conductivity up to 110 W/m-K and low in-package resistance of about 0.5 K/W for silver, copper and nickel-palladium-gold lead frames. The materials can be used for up to 24 hours continuously, and have an open time of two


hours and a stage time of as long as four hours. Contact: Henkel Electronic Materials, LLC,


14000 Jamboree Road, Irvine, CA 92606 % 714-368-8000 E-mail: doug.dixon@henkel.com


Web: www.henkel-adhesives.com See at The ASSEMBLY Show, Booth 2201


Page 93


SCIENCE knows why it works.


CARE knows why it’s


important that it does.


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