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www.us-tech.com
September, 2018 Aven Releases Interchangeable-Lens Magnifying Lamps
Ann Arbor, MI — Aven’s ProVue Solas magnifying lamps are designed to offer the flexibility of utilizing multiple, interchangeable lenses in a
durable and stylish housing. Users can enhance working distance, mag- nification, or field of view without having multiple lamps on hand.
The ProVue Solas is available in two models. The Solas XL35 includes a five-diopter lens (2.25x magnifica- tion), but also accommodates an optional three-diopter lens (1.75x magnification). The Solas XL58 includes an eight-diopter lens (3x magnification), but also accommo- dates an optional five-diopter lens (2.25x magnification).
The ProVue Solas has a fasten- ing ring that is placed over the installed lens and is easy to loosen and tighten when switching out lens- es. 60 ultra-bright, white LEDs pro- vide shadow-free illumination with a lifespan of 20,000 hours. The lamp head includes micro-touch buttons to adjust the brightness intensity of the LEDs. The 36 in. (91.4 cm) covered- spring, balanced arm meets inspec- tion needs without any exposed springs or pinching hazards. A ten- sion knob allows optimal lamp head positioning. The ProVue Solas comes
complete with a heavy-duty table clamp and power adapter.
ProVue Solas magnifying lamp. Contact: Aven, Inc., 4330
Varsity Drive, Ann Arbor, MI 48108 734-973-0099
E-mail:
markk@aventools.com Web:
www.aveninc.com
See at SMTAI, Booths 1116 and 1118
Finetech Showcases Sub-Micron Die Bonder
CoaxStrip 6380 New Powerful, Yet Precise Coaxial Cable Stripping Machine
To Be Precise.
See at The ASSEMBLY Show, Booth 231 and MD&M Minneapolis, Booth 729
Gilbert, AZ — Finetech is showcasing its high-accuracy, production bonder, the FINEPLACER® femto 2, at IMAPS 2018. This die bonding plat- form was developed for advanced packaging and bonding in automated precision manufacturing, with a focus on high yield.
With a placement accuracy of
0.02 mil (±0.5 μm), at three sigma, and process flexibility, the machine supports a wide range of applications at both chip and wafer levels. As a “Prototype2Production” system, it accommodates applications that migrate from process and product development to automated low-vol- ume production environments. The system is suitable for opto- electronics, semiconductors, silicon photonics, medical engineering, sen- sor production, and R&D. Supported applications include laser diodes, laser bars, VCSEL/PD, LED packag- ing, active optical cables (AOC), opti-
cal engines, TOSA/ROSA, lens attach, MCM, MEMS, sensors, 3D/2.5D IC, C2C, C2W, chip-on-sub- strate, chip-on-glass, chip-on-flex, and more.
FINEPLACER femto 2 die bonding platform.
Providing Reliable Protection for: • Military & Defens
g
Military & Defense • Consumer Electro • Wearab
nsumer Electronics rable Techno ogy
Technollogy • Printed Circuit Boards
Parylene (XY) • Urethane (UR) • Acrylic (AR) • Silicone (SR)
• Parylene (XY) Ds D f
• Aerospace • Automotive • Medic Medica • LEDs
Aerospace
motive cal
ethane (UR) • Epoxy (ER) We also offer Parylene machine sales and consulting. See at MD&M Minneapolis, Booth 2441
The bonder can be configured for specific applications with a wide range of process modules, enabling many bonding technologies, such as eutectic and epoxy die attach, adhe- sive bonding and curing, thermo- compression bonding (force from 0.05 up to 1,000N) and thermo-sonic bonding, diffusion bonding (SLID, TLPB, Cu-Cu), as well as laser- assisted die bonding, bump bonding, and copper pillar bonding. High- quality dispensing options allow lines, dots and patterns, as well as micro-dipping solutions for small components and contact areas. The FPXVision™ vision align- ment system is designed for high- precision requirements. Maximum resolution and real-time optimized camera images enable a uniformly sharp representation of fine struc- tures across the entire field of view. Numerous illumination options allow for a larger scope of variations when working with different materials and surfaces.
For applications that require particularly fast temperature process- es, a high-speed heating plate provides ramps of greater than 108°F/s (60°C/s).
Contact: Finetech, Inc., 560 E. Germann Road, Suite 103, Gilbert, AZ 85297 480-893-1630 E-mail:
adg@finetechusa.com Web:
www.finetechusa.com
See at IMAPS, Booth 512
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