September, 2018


www.us-tech.com


E by SIPLACE Boosts Capabilities for Mid-Speed Market


By Mark Ogden, Senior Manager — Regional Marketing Americas, ASM Assembly Systems


ties in the mid-speed sector. Hundreds of plat- forms are now installed around the world, while the systems’ feature set is growing and evolving. The system handles a wide spectrum of appli-


I


cations — from long-strip LEDs to advanced, high- reliability medical devices — and serves the needs of EMS and OEM companies alike. E by SIPLACE has many of the robust capabilities found in ASM’s high-speed systems, while addressing the cost and quality requirements so critically necessary for a competitive advantage in the mid-range market.


Continuous Improvement Continuous improvement is an


integral component of ASM’s philoso- phy. This approach is applied across the product range, including E by SIPLACE. To that end, every platform is now available with SIPLACE Pro, making the platform’s software capa- bility excellent among mid-speed placement systems. From the start, users have the same programming experience as those running produc- tion with ASM’s high-speed SIPLACE SX placement machine. This client- based software allows all program- ming to occur offline with multiple users. CAD data and Gerber images can be imported easily for offline vir- tual product build for debugging, placement simulation and the elimi- nation of first article builds. With SIPLACE Pro as the foun-


dation, other ASM software modules are now accessible with the E by SIPLACE. Well-known productivity enhancement functionality including component verification, offline set up, advanced changeover strategies, traceability and third-party software integration are available with this powerful mid-range platform for adaptability as process needs change. SIPLACE Pro and these other pro- ductivity tools can now be integrated with new equipment orders or retro- fitted to systems already in the field. “Compared with other systems


we’ve used, the ASM software is much easier. For example, to manip- ulate a new part, all it takes is a click and drag on the screen to program it,” says Michael Johnson, president of Hi-Tech Electronics. “Compare that with having to input component pitch, diameter, length, and height and the time difference is incredible. With the SIPLACE Pro, component measurements are managed by the software automatically.” A new addition to E by SI PLACE


in recent months is its odd-shaped com- ponent (OSC) placement capability, allowing automation of parts place- ment through accurate vision system recognition of irregularly shaped pack- ages. Not only does OSC effectively handle odd-shaped components, but also leverages powerful 3D stereoscopic vision technology to provide better detection of defective leads or pins. This capability helps avoid


placement of substandard parts, and also ensures better alignment of usable part pins to through holes for improved placement accuracy and yield. With the ability to automate what is generally an end-of-line man- ual placement process, the OSC placement function of E by SIPLACE helps improve product quality, increases automation and placement


See at SMTAI, Booth 229


n the two years since its Americas debut, ASM Assembly Systems’ E by SIPLACE placement machine has continued to expand its capabili-


speed, optimizes floor space and allows for the integration of new components when required.


Rotary Head Technology At the heart of the machine is its workhorse


At the heart of the E by SIPLACE is its rotary placement head with standard placement force control.


placement head, which differentiates E by SIPLACE significantly from common gang-pick systems. ASM’s rotary head technology is designed to offer a true, accurate representation of cph based on IPC ratings, since real-world perform- ance does not derate as much as gang-pick place- ment solutions. The E by SIPLACE placement heads allow for process control and adaptation with the ability to Continued on next page


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