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www.us-tech.com
September, 2018
YXLON CT System Equipped with New Line Detector
San Jose, CA — With the YXLON CTScan 3, YXLON has launched a completely new line detector to replace its
Y.LineScan predecessor. As of now, the company’s CT Compact computed tomography (CT) system will be equipped with the new line detector as standard. In the future, YXLON’s FF85 CT and CT Modular systems will also use the new detector. Technological advance- ments and optimized production methods deliver excellent image
quality and a significant reduction in the system’s susceptibility to noise. Specially developed photodiodes ensure an extremely uniform signal. Previously, crystals had to be
manually split by specialists, but production is now machine-support- ed by the CTScan 3, resulting in an improvement in crystal uniformity by a factor of five. This leads to reduced ring artifacts, and the high repeatability of the signal allows optimal calibration.
Due to the system’s higher
dynamic range and better signal sta- bility, greater material thicknesses can be tested with the same X-ray energy. The solid housing is particu- larly resistant to temperature fluctu- ations, keeping electronics cool. At the same time, it allows very little scatter within the detector, resulting in much sharper images, cleaner edges and improved detail. The CT Compact system is an efficient fan-beam CT system for
medium-to-large castings designed for the automotive and aerospace industries, but it is also suited for the
CTScan 3 X-ray line detector.
non-destructive analysis of dense art, historical and archaeological objects, as well as large-scale geological sam- ples. Multiple CT projections can be generated in a single test run, each with different parameters for the dif- ferent object areas. More than one component can be displayed in each test cycle using the multi-part test-
ing function. Contact: Comet Group Lab One,
3055 Orchard Drive, San Jose, CA 95134 % 408-325-8770 E-mail:
paul.smith@
cometusa.com Web:
www.comet-group.com
See at SMTAI, Booth 810
Practical Components Offers New Fine-Pitch Glass Chips
Los Alamitos, CA — Practical Com - ponents, Inc., a supplier of dummy components and test boards, is now offering a FC150JY Type B, 0.4 x 0.4 (10 x 10 mm), full-area glass chip, extending its line of available chips. The chips are 28 mil (700 µm) thick, ±3 mil (70 µm), with a bump pitch of 6 mil (150 µm). They can be ordered in copper pillar versions with SnAg solder caps. The glass chips provide the
solution to checking the mechanical bonding between chip and PCB with underfill. They have been proven to be valuable in evaluating SMT adhe- sives and applications used in SMT assemblies, when fixing components to the board during wave soldering or double-sided reflow. The chips are available as an
uncut 8 in. (20.3 cm) wafer contain- ing 208 chips per wafer, or ordered diced as required with available sub- strate kits.
Practical Components strives to
offer value pricing, on-time delivery and excellent customer service. The company’s team is ready to provide project assistance in the areas of technical component knowledge, drawings, component land patterns,
and PCB practice kits. Contact: Practical Components,
Inc., 10762 Noel Street, CA 90720 % 714-252-0010 fax: 714-252-0026
E-mail:
mkennedy@practicalcomponents.com Web:
www.practicalcomponents.com
See at IMAPS, Booth 827 See at SMTAI, Booth 933
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