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www.us-tech.com


September, 2018


Data I/O Focuses on UFS and MES Integration


Redmond, WA — Data I/O is investing heavily in new technologies, such as universal flash storage (UFS), manu- facturing execution system (MES) in- tegration and secure provisioning. Automotive flash memory de-


mands show no sign of slowing, with UFS providing the next wave of per- formance and density. Automotive electronics programmable content is projected to grow from 32 GB to over 1 TB and beyond by 2025, driven pri- marily by infotainment systems, con- nectivity and autonomous driving.


Data I/O has met this demand


with its LumenX™ programming system. Data I/O’s ConneX traceabil- ity and reporting software allows manufacturing companies to inte- grate preprogramming into their MES systems. The SentriX™ secure provisioning platform helps OEMs of any size and volume provision secret credentials into their devices secure- ly and cost-effectively. The PSV family of program-


ming systems is an automated pro- gramming solution with speed, flexi-


bility, fast changeover, and small parts handling. Engineered for veloc- ity and versatility, the PSV family combines robotics handling with Lu- menX programming technology for fast device programming and high socket density. A comprehensive suite of process control software ap- plications, along with fiber laser marking and 3D coplanarity compo- nent inspection, meets the demand- ing process requirements for automo- tive electronics applications. The PSV family supports both


FlashCORE III and LumenX pro- grammers. Current customers with PSV systems have built-in invest- ment protection as they can upgrade their systems to add LumenX pro- grammers alongside their current technology. The combination of ultra- fast read/write and download speeds, high socket capacity and high throughput allows manufacturers using one PSV system to program what previously required multiple


systems to produce. Contact: Data I/O Corp., 6464


185th Avenue NE, Suite 101, Red- mond, WA 98052 % 425-867-6922 E-mail: higginj@dataio.com Web: www.dataio.com


DAU Offers Heat Sinks for Power Electronics


Macedon, NY — DAU, a part of MIBA group, is now offering a fo- cused product portfolio of heat sinks that address a wide range of devices, including high-end cooling applica- tions. The company has an in-house testing department, containing state- of-the-art equipment, providing tech- nical support for thermal challenges. In power electronics, heat losses


occur that must be dissipated to pro- tect the electronics from derating or being damaged. Heat sinks made from solid or hollow aluminum are


Heat sinks for power electronics.


often used, onto which electronic components are mounted. Reliability and service life of every electronic circuit depends on the operating tem- perature, which highlights the im- portance of adequate cooling. DAU has positioned itself as a


competent development partner for thermal solutions. Its main target groups are electronics and mechani- cal development engineers. The com- pany’s goal is to engineer suitable so- lutions for challenging thermal ap- plications. The company can delve into the


customer’s application and has the de- velopment and test equipment to sup- port the project all the way to hard- ware validation. DAU strives to offer a variety of technologies to engineer the optimal cooling solution in close col-


laboration with its customers. Contact: DAU Thermal Solu- tions North America, 1657 East


Park Drive, Macedon, NY 14502 % 585-678-9025 fax: 585-678-4027 E-mail: sales@dauusa.com Web: www.dauusa.com


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