September 2026
www.us -
tech.com
SUWANEE, GA — AI servers pose a new set of challenges for SMT production operations. Ever larger and heavier ball grid arrays (BGAs) with tens of thousands of balls, over- sized circuit boards and extremely high com- ponent density require stable SMT manufac- turing processes. ASMPT SMT Solutions shows that these requirements can be met al- ready today with the proven SIPLACE SX placement platform and end-to-end inline quality controls. Modules measuring up to 150 × 150 mil-
limeters and weighing more than 500 grams are no longer the exception, with even larger and heavier components being foreseeable. At the same time, the number of connections continues to grow. Together with ICs, QFNs,
electrolytic capacitors and thou- sands of highly miniaturized pas- sive components, a single circuit board may have more than 20,000 placement positions. In addition, the passive com-
ponents must be placed with great precision not just in high densities, but often in varying angular positions. To meet these requirements, the SIPLACE SX can be equipped with the CP20 collect-and-place head. With 20 separately operating segments, it enables offset corrections and the high-precision assembly of even
AMADA WELD TECH Expands SIGMA LS
Laser Platform MONROVIA, CA — AMADA WELD TECH has announced key enhancements to its SIGMA LS laser micromachining subsys- tem, centered on a new motor- ized beam delivery head and flexible vertical and horizontal mounting options. These upgrades reduce instal-
lation complications and give ma- chine builders and system integra- tors greater freedom to integrate femtosecond laser micromachining capabilities into complex produc- tion lines and dedicated work cells, all while maintaining high preci- sion and pro cess stability. The SIGMA LS subsystem
combines a femtosecond laser, beam delivery optics, scan head or cutting head, focus lens, cam- era, and controller/software in a single, integration-ready pack- age, reducing engineering time and risk for OEMs and system integrators. Femtosecond laser options
are available from 5W to 80W and IR, green, or UV wavelength choices.
Contact: Amada Weld Tech, Inc., 1820 S Myrtle Avenue,
Monrovia, CA 91016 % 818-601-9558 E-mail: john.di-
giacomo@amadaweldtech.com Web:
www.amadaweldtech.com
See at The Battery Show, Booth 3242
densely placed components in any angular position within a single head cycle. For large and heavy processor BGAs, the TWIN VHF placement head is available. It
Page 69 ASMPT: Solutions for AI Server Board Production
uses nozzles that are specially designed for the respective component. The system also deter- mines the inertia of each BGA and takes it into account during the program generation so that even heavy components can be processed safe- ly and reliably. Programming is done with the WORKS Software Suite, into which the BGAs’ geometry data can be imported. The PCB han- dling is also designed to meet these special re-
quirements. Contact: ASMPT, 3975 Lakefield Court,
Suite 106, Suwanee, GA 30024 % 770-797-3189
E-mail:
ogden.mark@
asmpt.com Web:
www.asm-smt.com
ASMPT line for AI server board production.
See at SMTA Guadalajara, Booth 410, and SEMICON West, Booth 1153
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