September 2026
ST. LOUIS, MO — ELANTAS North America is highlighting material technologies de- signed to protect electronics operating in de- manding environments across the industrial, automotive, energy and transportation sec- tors at SMTA Guadalajara 2026. As electronic systems become more ad-
vanced, they are increasingly expected to perform reliably in harsh operating condi- tions. Whether installed inside a utility smart meter, an electric vehicle charging sta- tion, an agricultural controller or an automo- tive electronic system, today’s electronics re- quire materials that can withstand moisture, chemicals, vibration, thermal cycling and other environmental challenges. ELANTAS will feature a range of confor-
mal coatings, encapsulants and potting materials developed to help manufacturers improve product reliability and extend service life. Featured solutions include Bectron® PT 4600, Bectron PT 4601, Bectron PT
CSZ to Highlight Enhanced Z-Plus Benchtop
www.us -
tech.com
4700, CONAP® CE-1170, Conathane® CE- 1164, Damival® U602 and CONAP EN-5852. For smart meter manufacturers, ELAN-
Page 61 ELANTAS Offers Proven Protection for Electronics
TAS materials help protect sensitive elec- tronics from long-term outdoor exposure while supporting accurate, dependable per- formance throughout the product’s service life. In automotive applications, the compa- ny’s solutions are engineered to protect sen- sors, control modules and other electronic as- semblies from heat, vibration and environ- mental contaminants found in both conven-
tional and electric vehicles. Contact: ELANTAS North America,
LLC, 5200 North Second Street, St. Louis, MO 63147 % 314-621-5700 E-mail:
anderson.arvelo@
altana.com Web:
www.altana.com
Protective conformal coating.
See at SMTA Guadalajara, Booth 111, and The Battery Show, Booth 2022
3D-CT AXI 3Xi-ZS1EX
Chamber CINCINNATI, OH — Cincinnati Sub Zero (CSZ) will showcase its enhanced Z-Plus
stackable
benchtop temperature/humidity chamber at SEMICON West 2026. The chamber enables inde- pendent environmental testing in a space-efficient configuration and is well-suited for research, reliability, and product valida- tion applications. Laboratory space is often
limited, making it difficult to ex- pand environmental testing ca- pacity. The enhanced Z-Plus benchtop chamber allows labora- tories to increase testing capaci- ty by vertically stacking two chambers. Each chamber oper- ates independently, providing flexibility to run different tem- perature and humidity profiles simultaneously while maintain- ing a compact footprint. The Z-Plus benchtop cham-
ber features an 8-cu.-ft. interior and is available in temperature- only or temperature and humidi- ty configurations. The chamber supports a variety of environ- mental testing applications, in- cluding research and develop- ment, reliability testing, and
product validation. Contact: Weiss Technik
North America, Inc., 12011 Mosteller Road, Cincinnati, OH 45241 % 513-719-3245 E-mail:
kristal.yelton@
cszproducts.com Web:
www.cszproducts.com
See at SEMICON West, Booth 149
EX
LARGE-FORMAT 3D-CT INSPECTION. Compact Footprint. Powerful Results.
Designed for today’s increasingly large and complex electronic assemblies, SAKI’s 3Xi-ZS1EX delivers high-resolution 3D-CT inspection for extra-large PCBs. Inspect boards up to 1,000 x 690 mm (39.37 × 27.17 in.) with advanced imaging, AI-assisted inspection and high-speed perfor- mance: all in a compact, prodution-ready system.
WHY SAKI 3Xi-ZS1EX IS DIFFERENT
High-Resolution Inspection for Large Boards
Inspect extra-large PCBs with detailed 3D-CT imaging, without requiring a larger inspection plat- form or additional factory space.
Advanced CT Technology SAKI’s proprietary planar CT technology combines X-ray images from multiple angles to create images and detailed 3D data for comprehensive internal inspection.
Faster Inspection, Higher Throughput Optimized mechanical design, a high-speed X-ray detector and image quality.
KEY INNOVATIONS
Planar CT Combines multiple X-ray images into detailed 3D datasets, enabling multilayer internal inspection from a single scan.
AI Denoise & AI Inspect Void Automatically enhance image quality and optimize void detection
without manual tuning for accurate, reliable inspection.
Large-Format Inspection Image-based warpage compensa- tion, THT inspection, tall-compo- nent inspection and advanced BGA analysis support increasingly complex assemblies.
EXPANDABLE BY DESIGN
The 3Xi-ZS1EX combines large- board capability with a compact automatically sets the imaging area and generates the inspection library, helping minimize setup time and production interruptions.
THE RESULT
More capability. Faster inspection.
https://www.sakicorp.com/en/
See us at SMTA International 2026 Booth 2539
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84
