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September 2026 ElEctronic Mfg SErvicES
Scienscope Advances Connected Inspection and Material Automation
By Michael Skinner, Editor
way of a connected portfolio of in- spection, inventory manage- ment, storage, and autonomous material handling technologies. Building on more than 30 years of experience in X-ray and video inspection, the company is devel- oping systems intended to help manufacturers improve trace- ability, reduce labor-intensive handling, increase production visibility, and support more au- tonomous factory operations. Its recent introductions in-
S
clude the WH-TWR-2000 storage tower, AXI-8000 automated 3D CT system, WH-SR1-JM24 smart rack, and automated guid- ed vehicle solutions. Together with Scienscope’s component counters and inventory manage- ment systems, these products form an integrated material and inspection ecosystem.
Automating Component Storage
The WH-TWR-2000 was de-
cienscope International is expanding its role in elec- tronics manufacturing by
veloped for high-mix, high-volume SMT operations where manual reel storage can create inventory errors, excessive handling, and in-
Automated retrieval reduces
operator dependency, while real- time tracking helps manufactur- ers locate inventory and main-
cused on building a complete in- telligent material management ecosystem rather than stand- alone machines,” says Danny Lumbreras, sales and service manager of the Americas. This broader approach con-
nects the storage tower with smart racks, inventory manage- ment solutions, AGVs, X-ray component counters, and MES or ERP platforms. The objective is to create an environment in which materials can be counted, stored, located, transported, and delivered to production with less manual intervention.
Advanced 3D CT Inspection Scienscope’s AXI-8000 ad-
Scienscope focuses on building a complete intelligent material management ecosystem, rather than standalone machines.
efficient use of floor space. The system provides high-capacity au- tomated storage while protecting moisture-sensitive and ESD-sen- sitive components.
tain accurate records. The tower can also connect with existing manufacturing software and fac- tory automation systems. “At Scienscope, we are fo-
dresses the inspection challenges created by denser PCB assem- blies, smaller component pack- ages, and hidden solder joints. The system uses automated 3D computed tomography with 360- degree scanning and simultane- ous scan-and-reconstruction technology. This process generates com-
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plete 3D datasets and allows users to examine arbitrary XY cross-sectional slices without damaging the assembly. It is in- tended to identify defects includ- ing voiding, head-in-pillow condi- tions, insufficient solder, bridg- ing, and internal structural anomalies that may be difficult to detect with conventional 2D X- ray inspection. A large X-ray cone angle im-
proves vertical resolution, while the system is designed to pre- serve production throughput. This combination is particularly relevant for aerospace, automo- tive, medical, and advanced in- dustrial applications, where hid- den defects can create serious re- liability risks.
“Manufacturers today can-
not sacrifice speed for accuracy,” Lumbreras says. “The AXI-8000 was designed to provide both.”
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Improving Material Flow Scienscope is also address-
ing inefficiencies created by manual material transport. Op- erators in many factories spend significant time moving reels,
Continued on next page See at The Battery Show, Booth 2414
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