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Page 54


www.us - tech.com


September 2026


Aven to Showcase Hands-On Inspection Solutions


ANN ARBOR, MI — At SMTA Guadalajara 2026, Aven Tools will demonstrate its MicroVue 2.0 all-in-one digital microscope, giving visitors a hands-on look at how the system can be used across inspection, rework, and quality control applications. Built for tasks like PCB in-


spection, solder joint evaluation, and component analysis, Micro - Vue 2.0 combines high-resolution imaging with a compact, self-con- tained design. The system fea- tures a 13.3 in. integrated HD


monitor, eliminating the need for external screens or traditional eyepieces — helping reduce opera- tor fatigue while streamlining the inspection process. Additional capabilities in-


clude a magnetic ring light with interchangeable 365 nm UV lighting and sector control, al- lowing users to better highlight surface defects, contamination, and fine details. The system also offers extended working dis- tance, precise focus adjustment, and built-in software for image


capture, measurement, and doc- umentation. With a focus on practical us-


ability, MicroVue 2.0 is designed to simplify setup and improve consistency on the production floor, whether used in manufac- turing, lab environments, or fail-


ure analysis. Contact: Aven Tools, 4330


Varsity Drive, Ann Arbor, MI 48108 % 734-973-0099 E-mail: markk@aventools.com Web: www.aventools.com


MicroVue 2.0 digital microscope.


See at SMTA Guadalajara, Booth 223


BTU: Reflow Solutions for Large AI Server Boards


The Full Convection Refl ow Soldering Portfolio with the most energy saving solutions


F-Series


Soldering with Formic Acid and Vacuum within a fl exible carrier & inline solution


Full Convection Refl ow Soldering


R-Series


WESTFORD, MA — BTU International is showcasing its latest Aurora reflow technology tailored for heavy boards and high-yield applications at SMTA Guadalajara 2026. Highlighted in the


booth will be BTU’s Aurora platform which includes the 200N model — a high-capaci- ty reflow system de- signed for processing large, heavy printed circuit board assem- blies used in AI infra- structure, high-per- formance com puting, networking, and data- center applications. With 200 inches


V-Series


Refl ow Soldering with Vacuum


to achieve higher yields while maintaining the productivity re- quired for volume electronics manufacturing. The Aurora Vacuum plat- form incorporates several inno-


BTU offers reflow systems for large and heavy boards.


Save the date and meet us / Hall 9 - A22


of heated length, flexible heating and cooling configurations, and advanced conveyor technologies, the Aurora 200N delivers the thermal performance required to process increasingly complex and thermally challenging assem- blies while maintaining excep- tional throughput and process consistency. BTU will also feature its


www.smt-wertheim.com


new Aurora Vacuum™ reflow oven, a next-generation vacuum reflow system that combines low- void soldering performance with production-ready throughput. Designed with a large-format vacuum chamber and optional dual-lane operation, Aurora Vacuum enables manufacturers


vative technologies that distin- guish it from conventional vacu- um reflow systems. An exclusive vacuum soft-


start process minimizes compo- nent movement and process-in- duced defects, while integrated heating within the vacuum chamber provides exceptional thermal profile control and process consistency — even for


heavy boards. Contact: BTU International,


Inc., 10 Lyberty Way, Westford, MA 01886 % 978-667-4111 Web: www.btu.com


See at SMTA Guadalajara, Booth 745 and IMAPS, Booth 308


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