October, 2024
www.us -
tech.com
Page 83 IDS Offers 2D Cameras for Wire Bond Inspection
STONEHAM, MA — Wire bond- ing is a key process in semicon- ductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections be - tween a semiconductor chip and other components. The distances between the bond wires are often less than 100 micrometers. Wire bonding requires the
highest precision and forms the basis for the production of high- performance electronics. F&S BONDTEC Semiconductor GmbH from Braunau, Austria, relies on image processing technology with industrial cameras from IDS Imaging Development Systems GmbH for the precise determina-
Automatic Schematic Generation in the Cloud from EPLAN
SCHAUMBURG, IL — Auto - mating the generation of sche - matics leads to faster results and fewer errors. Solutions provider Eplan has developed a variety of technical approaches for this process. One of these is the cloud- based software eBuild. The new Version 2025 is now
available, with significant advan- tages in ease of use, operation, and for configuring and generat- ing schematics. Automa tically generating schematics is getting increasingly innovative and the cloud has become indispensable in this process. Eplan’s eBuild Version 2025 software, which is fully integrated into the Eplan Cloud, offers numerous improve- ments for more efficient use of macro technology in engineering. The user interface has been
optimized so that users have a better overview of the project even more quickly. A new Navigator bar enables users to monitor the eBuild configuration and genera- tion process at all times. A set of rules and configura-
tion interfaces can be intuitively and quickly created without knowing any higher program- ming languages. These Eplan macros are then augmented in eBuild with a set of rules. Users next use this configuration method to input their client’s requirements for a machine or plant system. A new feature in eBuild 2025 is the ability to con- figure from an internet browser
on Windows, Android or iOS. Contact: EPLAN Software &
Services, LLC, 425 N Martingale Road, Suite 470, Schaumburg, IL 60173 % 847-744-5729 E-mail:
raymundo.d@eplanusa.com Web:
www.eplanusa.com
tion of wire positions and for qual- ity assurance. Wire bonders are avail-
able with various degrees of automation. With manual devices, each bond position must be approached manually before the corresponding con- nections can be made. Semi- automatic machines automat- ically position the wire after the first bond to create a wire bridge. Fully automatic mach - ines use a structure recogni- tion system to determine the position of the chips. Between one and seven
industrial cameras are used per system. Depending on the type, these can be the particularly compact and cost-effective uEye
XCP models. At just 1.14 x 1.14 x 0.67 in. (29 x 29 x 17 mm), they
B connection and compatibility with the Vision Standard (U3V/ GenICam) simplify integration. F&S Bondtec also uses uEye CP cameras. These tiny power- houses offer maximum func- tionality with extensive pixel pre-processing and are also per- fect for multi-camera systems thanks to the internal 120 MB image memory for buffering image sequences. Users can choose from a large number of
56i series wire bond system with IDS cameras.
are the smallest housed IDS cameras with C-mount and have a completely enclosed die-cast zinc housing. Their screw-type USB micro-
modern CMOS sensors. Contact: IDS Imaging
Development Systems, Inc., 92 Montvale Avenue, Suite 2800,
Stoneham, MA 02180 % 781-787-0048 E-mail:
usasales@ids-imaging.us Web:
www.ids-imaging.us
Headquarters, Vista, California, USA. +1 (760) 438-1138 -
sales@visionpro.com
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